Electronics Forum | Tue Jan 26 12:25:44 EST 2010 | blnorman
You can try a 5% solution of sulfuric acid. It's used to clean copper foils to IPC-TM-650 method 2.3.15 prior to testing for purity.
Electronics Forum | Tue Jul 20 16:02:12 EDT 2010 | mikesewell
You may want to look at IPC 7721 Method 3.2 Bow and Twist Repair. In extreme cases you may need clamp or weight the pcb with bow in the other direction to yield a "flat" pcb in the unrestrained state. You will have to take the PCB up to or slightly
Electronics Forum | Mon Dec 20 10:20:14 EST 2010 | 18424
Test Resistance to ECM shall be 65C +- 2C @ 88.5% +- 3.5% All SIR Measurements shall not exceed 100 MOhm. I am not sure of voltage.
Electronics Forum | Fri Sep 23 12:42:40 EDT 2011 | scottp
A solder drip like that is completely unacceptable. That could easily short two QFP leads. Very poor quality. Your customer is right to be upset. You need to pony up the money for IPC-610, agree with your customer to which level you're working (1
Electronics Forum | Tue Oct 04 14:36:12 EDT 2011 | blnorman
Not aware of anyone that builds anything like the C3 selective extraction system. I know there is a move to develope and IPC test method for this process, but it's not there yet.
Electronics Forum | Wed Nov 23 10:34:39 EST 2011 | ahamid
What is the Industry standard for number of fiducials on PCB. Is it just 2,3 or 4 for good placement.Any reference to IPC or any other standards to support your suggestion.
Electronics Forum | Wed Sep 05 17:14:39 EDT 2012 | cpitarys
All that is required is the sample surface area. (LxWx2) Ref, IPC-TM-650. 2.3.26.1
Electronics Forum | Mon Nov 02 22:04:30 EST 2015 | davef
An ionic contamination tester should meet industrial cleanliness specifications including MIL-STD-2000A, MIL-P-28809, J-STD-001 and Resistivity of Solvent Extract (ROSE) Test Method IPC-TM-650 2.3.25
Electronics Forum | Tue Jul 19 11:10:04 EDT 2016 | ishwarsingh1
Thanks mike .. it would really helpful for me
Electronics Forum | Sun Oct 09 16:57:30 EDT 2016 | davef
IPC 2222A Sectional Design Standard for Rigid Organic Printed Boards, 5.3 Design Requirements for Printed Board Assembly
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