Electronics Forum | Wed Aug 04 01:03:16 EDT 1999 | Dean
| | | | HI EVERYONE, | | | | WE JUST BOUGHT 6 FCM MACHINES AND ARE HAVING | | | | A NUMERIOUS AMOUNT OF DOWN TIME COMPARED TO | | | | OUR 5 LINES OF FUJI EQUIPMENT.IS ANYONE HAVING | | | | BAD EXPERIENCE WITH PHILIPS FCM ETC? | | | | | | | | WHAT
Electronics Forum | Thu Aug 05 03:20:16 EDT 1999 | KEVIN SIMPSON
| | | | | HI EVERYONE, | | | | | WE JUST BOUGHT 6 FCM MACHINES AND ARE HAVING | | | | | A NUMERIOUS AMOUNT OF DOWN TIME COMPARED TO | | | | | OUR 5 LINES OF FUJI EQUIPMENT.IS ANYONE HAVING | | | | | BAD EXPERIENCE WITH PHILIPS FCM ETC? | | | | | |
Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon
| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol
Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L
| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b
Electronics Forum | Sat Jul 17 03:02:58 EDT 1999 | Jeff Sanchez
| | | | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | | | | | What is it you're trying t
Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee
| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a
Electronics Forum | Wed Jun 30 08:58:59 EDT 1999 | M Cox
| | | | snip | | | | | John and Dave, | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like p
Electronics Forum | Wed Jun 30 09:33:11 EDT 1999 | Earl Moon
| | | | | | snip | | | | | | | John and Dave, | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do t
Electronics Forum | Mon Jun 21 09:58:25 EDT 1999 | Christopher Cross
| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi
Electronics Forum | Wed Jun 23 11:47:48 EDT 1999 | Dave F
| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann
