Electronics Forum | Tue Nov 14 22:01:07 EST 2000 | Dave F
I'd love to get to the point that I could discuss the impact of flux on dross formation. Until then, I fight with proper solder pot temperature, maintaining enough pump speed, and solder contaminants.
Electronics Forum | Thu Jul 03 07:59:53 EDT 2003 | loz
OK. Point taken, lets keep this simple then, how about just the issue of under cured solder resist? Any body else encountered such issues. Just feedback, 'cause its something that just seems to have been highlighted to me. Thanks.
Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Tue Apr 28 07:45:07 EDT 2009 | davef
When using high tin solder, doesn't proper specing to avoid the effects of tin whiskers become at least as large an issue as proper specing for defect-free wave solder processing?
Electronics Forum | Tue Feb 25 06:18:55 EST 2020 | spoiltforchoice
First question would be why are you hand soldering these resistors? I would expect ENIG to be perfectly solderable after reflow and quite some time later. If you leave the apertures out of the stencil and then decide to automate fitting them, you'l
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F
Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�
Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising
Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without
Electronics Forum | Thu Jul 03 17:42:01 EDT 2003 | Kris
What have you not seen ?
Electronics Forum | Wed Jan 26 16:25:33 EST 2005 | patrickbruneel
Amen Dave
