Electronics Forum | Fri Apr 13 14:51:01 EDT 2001 | Mike R.
Some Selective wave solder jig designer milled down the jig in one depth which is based on the thickest part on the bottom side of the board. This will create problem on the warpage on the jig due to the heat coming from the wave soldering machine. I
Electronics Forum | Fri Apr 13 10:08:48 EDT 2001 | gcs
dgrenier is on the right track. We are a volume shop and with a up back stencil you can keep CFM line going with no down time. DMPO also at our shop have inproved. We also use AOI equipemnt as a process indicator to monitor when stenicls need to be c
Electronics Forum | Mon Apr 16 12:59:51 EDT 2001 | Mike R
If you will place a temperature strip on the board during wave soldering process you will get a max of 210 F or 98.8 C which is normal on the standard wave temperature. The problem on the 10% solder on the TH via hole can be caused by insufficient fl
Electronics Forum | Mon Apr 23 11:58:42 EDT 2001 | CAL
I personally like Universals GSM and the Siemens F series for placement machines and companies. Both have great laboratorys set up for Flip Chip processing.Both Also have industry leading experts on staff. Machine info: can they do tacky flux dispen
Electronics Forum | Mon Apr 23 10:02:47 EDT 2001 | Cal
Mydata machines are great for large back planes close to 23" wide. The foot print of the Mydata machines are concerning- being a "T" design it sacrifices floor space. Also, Mydata is not considered to be in the same classification (my opinion) of equ
Electronics Forum | Mon Apr 30 10:22:49 EDT 2001 | kaopsahl
Greetings. I have noticed quite a few postings lately to the effect of "hi, I want to be a SMT pro and make circuit boards, help me". Try to understand why folks on the forum are cringing at your proposal. All of the feedback I have seen regarding yo
Electronics Forum | Mon Dec 18 11:11:15 EST 2000 | markt
Can you recomend any information sources regarding European and Japanese Lead Free Solder Regulations? Are these pending regulations (WEEE) something that the entire EEC is looking at? As a company that exports to Europe what adjustments can we expec
Electronics Forum | Thu Oct 26 08:48:06 EDT 2000 | ptvianc
Of all of the process steps, paste printing is the most critical with respect to minimizing defects. Therefore, paste printing must be tightly controlled, particularly in the case of fine pitch (peripherally leaded) devices and BGAs. I believe that
Electronics Forum | Tue Oct 24 17:01:20 EDT 2000 | Philip A. Reyes
Hi! Good day!! My questions is about PBGA rework the ff are: 1. Is it necessary to reball the plastic BGA module after removing it from the PCB? Can you give me the process and critical requirements?(e.i.stencil) 2.After removing the PBGA modul
Electronics Forum | Thu Aug 24 16:54:33 EDT 2000 | Dr. Ning-Cheng Lee
52In/48Sn solder has a melting point 118C, and can be reflow processed at temperature down to around 165-170C. The material is very soft, very low in shear strength. It is relatively ductile, can be stretched to about 2-3X of Sn63 in elongation. Amon
