Electronics Forum | Mon Feb 20 13:29:44 EST 2006 | patrickbruneel
Great work Amol, Please keep us posted about the results of the x sectioning. I personally don't believe that the cracks are due to non-eutectic properties of SAC. Because the alloy is only 4�C off eutectic and when a solder joint exits the solder
Electronics Forum | Mon Apr 17 18:29:03 EDT 2006 | lit
There is learning on all brands requiring fine tuning the test parameters. The first point is not to allow defects to escape. Many brands can do a good job with preventing escapes. The struggle with all the brands becomes false calls. The companies r
Electronics Forum | Thu Jun 22 09:09:36 EDT 2006 | Chunks
Hi Evtimov, You need to call your manufacturer! Just joking! Sorry, but it is a "forum", which means you need to pick and choose your information carefully. Some are rookies that may give a simple or silly answer without knowing, some are seasone
Electronics Forum | Thu Nov 19 14:38:49 EST 2009 | doremi
Oh, my dear, printer is just a part of the full picture. Without good and stable pick and place what if the printer is excellent???It is all important - printer, solder paste,stencil,P&P,oven,AOI and of course good process engineers or whatsoever are
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Wed Mar 03 14:16:59 EST 2010 | davef
First, we expect that your equipment supplier would help you with this. Then again with lots of used equipment flying around, some of the basic stuff often gets pushed to the back of the bus. Second, here is a clip and paste on the basics of equipm
Electronics Forum | Thu May 26 13:28:12 EDT 2011 | blnorman
I agree with Dave on the processing issues, but there are others: Print speed capability (do you get good deposits at various print speeds), humidity exposure (our plant did get to the high side so moisture absorption on the board/stencil was an issu
Electronics Forum | Fri Jun 02 23:53:16 EDT 2023 | calebcsmt
In both IPC standards, it is referenced: "When 'X' standard is cited or required by contract, the requirements of 'X OTHER' do not apply unless separately or specifically required." I've always understood J-STD to be the act of assembling, where A-6
Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
