Electronics Forum | Thu Jul 29 12:24:59 EDT 1999 | DLKearns
| | We are going to smt ic's on the component side of our pcb's. | | The problem is we are going to have to do this by hand. | | We have a hot air station and vac pencil, but How reliable is this process. | | We've tried it on proto's and had some sh
Electronics Forum | Tue Apr 07 17:33:17 EDT 1998 | Eldon Sanders
I agree with Michael, scoring works great. We build both and medium size small boards, anywhere from 2 to 100 square inches. Thickness from .030 to .062 Panels contain anywhere from 2 to 16 boards. About half are odd shaped, with cutouts and not
Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Wed Jun 24 16:45:18 EDT 1998 | Bill Schreiber
| I know this topic has probably been talked about before...But I ran into a small situation where Solder Balls were appearing in large quantities on the PCB....the Problem has been isolated and taken care of, my question is, what are some good metho
Electronics Forum | Mon Feb 25 11:12:32 EST 2008 | hegemon
It sounds more as though you have a profiling problem primarily, however, if your placement is not square to the board, then you should get your machine setup correct first. After that you can get to the profiling. If the BGA is brought up to tempe
Electronics Forum | Thu Dec 09 12:29:39 EST 2021 | stephendo
With the bottom followed by the top set up, how do you even come close to balancing that? For a lot of boards that I have seen you would need five or more top lines just to handle one bottom line. Or have the bottom line on a very low duty cycle. B
Electronics Forum | Fri Jul 21 11:30:39 EDT 2000 | Joe H.
Craig, Since you didn't share any detail regarding the component side of the board or what other components reside on the bottom side, I'm prepared to take a stab in the dark. Have you considered doing a double sided reflow on this board? Also
Electronics Forum | Wed Mar 14 17:33:42 EST 2001 | davef
Check Bob Willis' site. He calls this Single Side Multipass Endothermic Elongated Happy Reflow Soldering, er someting like that. Ha ha ha!!! Naw, he calls it Simultaneous Double-Sided Reflow Soldering. That might be something like you are talking
Electronics Forum | Mon Oct 25 16:04:02 EDT 1999 | Dave F
Jerry: You don't have to yell, we can see you fine Are your first side component going to fall off of the board or have their reliability affected during second side processing? If not, go for it!! Lots of people reflow through hole components.
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