Electronics Forum | Thu Feb 09 19:35:09 EST 2023 | youngbuck
Hello, We have a Dek Infinity when powering up will not initialize due to an error that says Rising Table Error (Position Error). I try to go to Diagnostics but it will not let me into anything. I press start when I'm in diagnostics and it just error
Electronics Forum | Fri Feb 17 19:48:01 EST 2023 | SMTA-64387083
15K sqft sounds like a good size facility, you should have someone that knows or learns about ESD and owns it. Check Out esd . org, ipc . org, smta . org for standards & info. Tile vs Epoxy = Tile's better but much higher initial cost. Pay attention
Electronics Forum | Fri Oct 13 10:44:03 EDT 2023 | yannick_herzog
Hello, thank you for your responses. Some time has passed since then. Unfortunately, we have been facing the issue of incomplete filling in the production when it comes to large openings in the template. This phenomenon occurs in both directions. T
Electronics Forum | Wed Mar 13 13:08:31 EDT 2024 | lambert
Section 8 in the J-STD-001 was the initial place to start with cleaning and the requirements, however with all the changes going on within the industry with increase product densities and such, a revision is being created to help understand the need
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Fri Jan 08 10:11:15 EST 1999 | Tim
This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality
Electronics Forum | Mon Mar 30 07:41:06 EST 1998 | Earl Moon
| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi
Electronics Forum | Thu Aug 22 12:18:51 EDT 2002 | dragonslayr
You wrote: The process stages of the project would include: Organise an initial meeting/workshop of interested parties to define the project and the proposed methods of data collection and gain agreement that this would be a benefit to the industry
Electronics Forum | Tue Oct 24 09:52:35 EDT 2006 | SWAG
We are having the exact same problem! We do about 6 or so ROHS SMT builds. 5 are fine now but we had problems with most initially and 1 is trouble still. All boards are same material, same PCB manufacturer. Initially, when the delam. problem occu
