Electronics Forum | Tue Mar 21 20:33:09 EST 2000 | Dave F
Shane: We don�t dispense, but we have thought about it. Several points about peelable solder masks in a no-clean (low residue) process: � Beware of latex peelable solder mask with a low res process without extensive testing. The problem is usuall
Electronics Forum | Wed Feb 07 21:56:00 EST 2001 | davef
Every critter out there with large incisors adapted for gnawing and nibbling has a different theory of solder ball formation. [My theory: It�s punishment for using NC fluxes. Stand and deliver. My solder balls end-up in the gross filter connected
Electronics Forum | Fri Mar 16 11:52:31 EST 2001 | J.D. of Panasonic
Ed, You certainly are ready for some equipment. I noticed in your message that you mentioned cost three times. So it is a very big issue to you. What everything depends on is where you see your company going in the next few years. Do you want
Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC
Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.
Electronics Forum | Thu May 10 02:57:03 EDT 2001 | kjellman
Hi, Why not have a look at Philips/Assembl�on, their ACM machine is quite nice. It may also bring you down to Flip Chip, 0201 some through hole and odd form placement. Nice options like bulk feeding, coplanarity tests, fluxing for FC, prom feeders (
Electronics Forum | Tue May 15 21:57:06 EDT 2001 | davef
Welcome!!! Where the hay ya been??? Sorry bud, were lining-up with your fab [it hurts me to say that, but when yer ] We used to dry pack with desiccants, also. Its probably an old MIL-STD-2073-1C requirement [er something like that]. We qui
Electronics Forum | Mon May 21 17:34:22 EDT 2001 | davef
Continuing the line of Michael's, the previous poster, comments ... The more Krispy Kremes, the better. Yeth!!! The more beer, the better. Yeth!!! The more epoxy, the better. Uh, I don think so!!! We look at this from a papa bear, mama bear, bab
Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon
Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p
Electronics Forum | Sat Feb 05 05:10:53 EST 2000 | Dean
It would be helpful to have some additional info on your line and process. Lets make some assumptions... Consider: re-tooling costs for your fab supplier. Can your supplier hold the additional tollerences for a larger panel. Can your supplier fab
Electronics Forum | Tue Jan 25 13:15:17 EST 2000 | Michael Allen
Thanks for the input Mike (and others). As you guessed, via-in-pad is not my idea, and I'm resisting it as much as I can. One of our designers used this practice at some other company, says there were no problems, and wants to use it (via-in-pad) a
