Electronics Forum | Wed Nov 21 05:57:30 EST 2018 | premkumar_haribabu
Hi Robl, Thanks for your qucik reply!! , i understand if we use aggresive flux that we can impove solder wetting over nickel plate vs PCB pads & we need to solder through 12 zones reflow oven. Prem
Electronics Forum | Tue Jan 29 17:11:32 EST 2019 | slthomas
Your product is Class 3, correct? Otherwise, a clearly wetted connection is all you need.
Electronics Forum | Fri Feb 08 10:52:24 EST 2019 | roblackey
BLT 31-41 "No Clean Selective Flux For Aerospace" On a Versaflow 3/45 Atomises well, good hole penetration, good wetting, cleans off well in the solvent cleaner. Use for SN100C, SA0307, and 60/40.
Electronics Forum | Fri Feb 15 17:42:47 EST 2019 | slthomas
Pd in the termination plating, maybe? That stuff has reeked havoc on wetting for me in the past, but that was in leaded assemblies at leaded temperatures. Maybe now with Pb free temps it works better?
Electronics Forum | Fri Jun 07 14:57:21 EDT 2019 | andrewpayonk
I never worked with F4G, just now getting our feet wet with Flexa. How is your CP642 holding up? We got our CP642 almost up and running
Electronics Forum | Thu Jun 27 08:12:17 EDT 2019 | SMTA-John
If the case shield is solderable, add pads to the edge of the two through holes and paste . This wetting should hold it in place.
Electronics Forum | Wed Aug 07 20:36:47 EDT 2019 | smith88
I am having trouble with achieving wetting on fences and I cannot find an IPC callout. What experience does the group have with fences install and inspection?
Electronics Forum | Tue Nov 26 18:35:20 EST 2019 | slthomas
It's hard to tell from the image but it looks like there isn't much room for a heel fillet. Seems like that could contribute to your voiding (or poor wetting) if there isn't enough paste volume there.
Electronics Forum | Fri Dec 27 14:22:00 EST 2019 | ameenullakhan
Hi , Thanks..., Its "not wetting the pads sufficiently" We have tried with RTS , Our paste is ROL0 based chemistry. Which solder have you changed. Regards, Ameen
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
