Electronics Forum | Thu Aug 26 10:49:36 EDT 1999 | Wolfgang Busko
| | | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | | Going through datasheets wasn�t that helpfull, so does anyone know of a source
Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon
I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve
Electronics Forum | Wed Mar 03 17:09:55 EST 1999 | Tom Reilly
We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 1394
Electronics Forum | Tue Dec 29 17:21:46 EST 1998 | Dave F
| I am looking for a questionaire/list of items that need to be addressed to determine the pros/cons and equipment, manpower, cost and lead time to determine if one should consider setting up an in-house SMT line. | Can anyone help? | thanks | | J
Electronics Forum | Fri Nov 27 13:04:47 EST 1998 | Phillip Hunter
| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the
Electronics Forum | Tue Oct 06 15:41:14 EDT 1998 | Mike C
| | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medium b
Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You
Electronics Forum | Wed Jan 09 20:40:58 EST 2002 | ianchan
Since we are on the topic, What we do over here, is to get SMT Technical to machine pick&place "sample component layouts" onto double-sided tape, which in turn is placed onto an actual PCB... QA will take that double-sided tape sample, and using an
Electronics Forum | Thu Apr 15 20:41:22 EDT 2004 | Ken
There are ledgitimate reasons for checking furnace calibrations, but let me clarify what that is. 1. TC's are not necessarily calibrted. Not unless you need "absolute" accuracy. TC's operate against a (non-linear) standard +/- a tolerance. Most
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
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