Electronics Forum: laser cut stencils (Page 49 of 57)

Stencil Printing Process Troubleshooting and control

Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas

Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Tue Oct 03 11:07:00 EDT 2000 | C.K.

"In Reality there's no additional cost or extra cost for the cleaning time since there is no increase on operator's wage in doing the cleaning but instead just an additional load or job for the operators at the same wage cost." I'd have to agree...

Stencil Cleaning OnBoard Forum Now In Progress

Electronics Forum | Thu Mar 01 10:46:11 EST 2001 | davef

Various lint free stencil wipe suppliers take various approaches to stencil cleaning. For instance ... Techspray Directions: Start with a dry TechClean Wipe (2358, 2361, or 2362) to remove excess solder pastes. Follow this with the 1608 Pre-Saturat

Re: Stencil opening for 0603,0402 ?

Electronics Forum | Wed Jul 22 11:27:25 EDT 1998 | Russ Miculich

I agree with the response and strongly recommend that you use the "home plate" design to reduce solder ball entrapment, and that the under cut for the 0402's in particular be 80% of the pad size. Solder slump is typically about 1.2 to 1 so spread wi

SMT Stencil Printer Recommendations

Electronics Forum | Sun Mar 04 02:39:27 EST 2012 | eadthem

I don't have our DEK printer part numbers memorized, In general we have a older machine running NT4.0 . It has 2Di inspection but we never use it because you can only inspect/setup 1 camera shot at once, making for very long programming. Our newer D

Re: Solder paste stencil modification

Electronics Forum | Fri Jan 15 09:11:28 EST 1999 | Steve Gregory

| Due to an foul up on my part, a circuit board ECO snuck up on me and I have a solder paste stencil that doesn't quite match the board. Two pads are off by about half a pad each. | | Can the solder paste stencil be modified? If so, what is the tec

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice

Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl

Re: Blood letting on stencil printer

Electronics Forum | Tue Oct 13 12:58:18 EDT 1998 | Justin Medernach

| We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will impact

Stencil thickness

Electronics Forum | Thu Jun 09 13:30:34 EDT 2005 | PWH

I would suggest 7mm thick "Durostone" as a carrier material. Cut lip/pocket for PCB so it is 0.05" thinner than thickness of PCB. Allow 0.010" gap on all sides of PCB. Machine lip to width between 0.050" and 0.100" to support under perimeter sides

Re: Placement of 0201'...patents on stencil openings? SHEESH!

Electronics Forum | Tue Jul 21 21:09:49 EDT 1998 | Steve Gregory

>Have you looked into legal crap like >>proprietary aperture designs. I didn't know it >>but some of these pick and place vendors >>actually have patents on things like pad and >>aperture geometry. Personally, I think that's >>crazy and shouldn't b


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