Electronics Forum | Wed Jan 15 07:25:37 EST 2003 | Jean-Philippe
LPMTF means Low Profile Multi-Tube Feeder and EMTF means Extended Multi-Tube Feeder. The difference is that the EMTF is bigger and it supports a wider range of tube.
Electronics Forum | Thu Feb 16 12:41:50 EST 2006 | fredericksr
Hey folks, I was interested in any information that you might have on tombstone reduction when using a lead free solder and profile. Thanks for any input that you may have! -Russ #x
Electronics Forum | Sun Dec 17 18:14:12 EST 2006 | greg york
circuitmaster designs prowave is unbeatable. They may have an agent in the usa if interested I will try to find out for you. cheers greg
Electronics Forum | Tue Dec 19 10:08:10 EST 2006 | George
Grant, Why don't you try a water-base flux which is No-clean, VOC-free also? I have tried the 270WR flux from AIM with good results even on lead-free process. My $0.02, George
Electronics Forum | Tue Dec 19 12:01:29 EST 2006 | patrickbruneel
Here�s a link to a previous thread that might be helpful http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6947Top Look what KEN has to say on the subject Patrick
Electronics Forum | Thu May 29 13:12:10 EDT 2008 | yam6rider
Just like to know what you guys thoughts regarding mixed alloys. Production run SAC305 and some components are SAC105. So, which profile should you follow. SAC105? or SAC305.
Electronics Forum | Wed Jul 02 08:30:32 EDT 2008 | interflux_electronics
Why not follow SAC305? you would do so for any other component finish wouldn't you? A component finish of pure Sn would also not call for a pure Sn profile, would it?
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Mon Mar 26 09:41:03 EDT 2018 | fuji_user_2014
Hi Gurus, Looking for alternatives to line makeup after reflow oven. Currently, I have a continuous on flat belt conveying out of my reflow oven straight to an EOL bench. The operator manually picks up the board off the belt (there is a roller at t
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?