Electronics Forum | Wed Jul 20 12:48:50 EDT 2005 | danhui888
Dear All, I'm looking for the complete SMT > equiment line (solder printer, P&P, Reflow) uses > for the small volume production line. I happen to > know that Manncorp and APSGold can provide the > complete ST line, but I haven't hear and use > t
Electronics Forum | Mon Oct 24 01:19:10 EDT 2005 | darby
Hi Mike, I use variations of both of these machines in a Tenryu FV-7100s and Samsung CP45/CP45Neos. Both have been very good machines - I would find it difficult to split them. I have personal dislikes of both tooling and support systems. I would ta
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph
Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D
Electronics Forum | Sat May 27 19:39:23 EDT 2006 | grantp
Hi, This must be the worst advice I have ever seen given on a forum. Really if you do what Guru says here, your going to go out of business so fast it's amazing. It personally cost me hundreds of thousands of dollars when I had to retire MYDATA
Electronics Forum | Sat Dec 09 09:51:14 EST 2006 | pvasquez
Hello Lou, As a high-mix low-to-mid volume manufacturer, you will need to concentrate on equipment that may be progammed very easily, with very quick debug time from assembly to assembly. I have worked with Agilent in the past, and one of my collea
Electronics Forum | Wed Feb 28 14:22:53 EST 2007 | samir
Hey Patrick, have you heard the latest on Al Gore? How typical and this doesn't include all the times Gore flies on private jets adding even more CO2 to the atmosphere. Can anyone say HYPOCRITE. "Al Gore�s Personal Energy Use Is His Own "Incon
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
Electronics Forum | Thu Apr 05 16:13:12 EDT 2007 | Ben T
D?rty, I was actually under the same mission as you a little over a year ago, but have since given up on the impossible. I have however been developing software for the industry for the past year. I have made a BOM importing tool, which cleans the BO
