Electronics Forum | Mon Mar 26 09:41:03 EDT 2018 | fuji_user_2014
Hi Gurus, Looking for alternatives to line makeup after reflow oven. Currently, I have a continuous on flat belt conveying out of my reflow oven straight to an EOL bench. The operator manually picks up the board off the belt (there is a roller at t
Electronics Forum | Fri Sep 11 13:57:24 EDT 1998 | Justin Medernach
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
Electronics Forum | Tue Jan 04 08:02:54 EST 2005 | Mike
Hi!! Where can I get information about Post- and pre-reflow rework? Some links, opinions?? Please Tell me? I would like to know too some methods and cost effective ways,that how we can rework repair printed boards? Thanks!!
Electronics Forum | Mon Jan 24 06:15:38 EST 2005 | David
Hi everyone! Is here anyone, who has experience about closed-loop feedback (AOI) with Pre- and post-reflow rework. I need too some internet links, whic handle by this subject. Thanks!!!
Electronics Forum | Tue Aug 07 08:20:47 EDT 2001 | CPI
Are there other components on the board? If so, how does solder quality look on them? Are they all reflowing? Are the sections of the uBGA�s sitting on a ground plane? Sounds like un-even heating. You should attach a couple thermal couples and see h
Electronics Forum | Thu Oct 26 11:49:54 EDT 2006 | sms_don
CW, The good news is that you are not trying to use SAC paste with SnPb balls for that would be a void generator due to the ball being liquidous while the SAC paste is still in a flux cleaning stage. Two points to consider: One, voids are not an i
Electronics Forum | Wed Oct 04 16:24:48 EDT 2006 | russ
try Alpha OM5100 this is a noclean paste that we use and have done the same thing you are now, reflowing pbfree with pb paste, we run to max temp of 230C with this paste and use a straight ramp with no soak profile is about 4 mins long from ambiant
Electronics Forum | Mon Dec 03 03:58:24 EST 2018 | ameenullakhan
Hi , Observed component drop during second reflow. Component : Image attached Perimeter : 0.15 to 0.025 cm No of leads : 22 Solder Alloy : Sn63/Pb37 As per component adhesion calculation the component should not fall. ( Excel Attached ) Profile
Electronics Forum | Wed Jan 05 16:21:17 EST 2000 | g cronin
hi glenn i have had nothing but good experiences with Heller. As far as i have seen they have very even heat characteristics, great profiling and overall low maintenance. I am very happy with heller and they are my oven of choice right now.. greg
