Electronics Forum: use (Page 50 of 2497)

Re: Profiling

Electronics Forum | Thu Jul 22 04:34:54 EDT 1999 | George Verboven

| Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | b) not s

Batch Cleaners

Electronics Forum | Tue Dec 08 11:49:44 EST 1998 | Dave F

All Y'All: A recent (10/98) article in "Circuits Assembly" magazine touted the use batch cleaners using a aqueous alcohol solvent. Reported benefits of this approach were: 1 Better use of floor space 2 Ability to develop custom recipes 3 Ability

Re: Wave Solder Flux Out With The Old & In With The New

Electronics Forum | Mon Jul 20 20:58:54 EDT 1998 | Dave F

| | Dave: | Wayne is correct with his analysis of ultrasonic spraying - we also use Sonoteks. However, your post didn't ask for a different system, just a clarification regarding your problem. What type of flux system are you currently using - s

Re: Wave Solder Flux Out With The Old & In With The New

Electronics Forum | Mon Jul 20 20:58:49 EDT 1998 | Dave F

| | Dave: | Wayne is correct with his analysis of ultrasonic spraying - we also use Sonoteks. However, your post didn't ask for a different system, just a clarification regarding your problem. What type of flux system are you currently using - s

BGA Via Plugging

Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin

Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom

HSP Utilization

Electronics Forum | Fri May 16 11:42:06 EDT 2003 | JB

We have used "feeder templates" in the past to keep components, that are shared by different products, on the same feeder slot number and it has worked well for us.We create a "master set up" say for product A that use 60 different components, the ne

CP6 pickup errors

Electronics Forum | Fri Feb 25 16:34:53 EST 2005 | jimmyb

In your PDs you must specify a single nozzle size. Meaning don't assume that entering nozzle size max=1.3 and nozzle size min=1.3 forces the machine to use a 1.3. Nozzle size min is not used in the CP6 software (it only uses nozzle size max), there

SMD nomenclature

Electronics Forum | Fri Apr 06 16:17:07 EDT 2007 | pima

Let me just shortly explain why do I open this thread. In my corporation in different plants we use same components at the same machines in different products(Fuji machines). I would like to create kind of global database of shapes ( its in FujiFlexa

Feeder Lubricant

Electronics Forum | Wed Oct 24 11:18:03 EDT 2007 | cyber_wolf

If you are talking about the REM oil sold for guns then I would not use it personally. B.T.W. REM oil has teflon in it. I quit using it on my guns because of its poor performance. It now resides in my garage...I use it to lube the axles on my push m

BGA Reballing Micro Devices

Electronics Forum | Mon Apr 29 14:36:26 EDT 2013 | bandjwet

I am trying to determine who out there is reballing devices below 0.4mm in pitch. We have been reballing as small as a 4-balled 0.15mm 4 mil ball diameter area array devices using an adhesive-backed reballing preform. 1. For such small devices we h


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