Electronics Forum | Fri Apr 14 11:00:38 EDT 2000 | Dave F
Mario: Your ask a very broad question and give no background information. Generally, the amount and type of residues present on a printed circuit board at the very beginning of a SMT line depends on the exposure of the board up to that point. For
Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
Electronics Forum | Sat Mar 25 10:13:18 EST 2000 | Robert Hutton-Squire
I am assembling a board with 2 x ALTERA FineLine PBGA devices. (256-pin and 100-pin) These devices have: surface pad size = 0.41mm (16) ball size = 0.48mm (18.9) ball pitch = 1.0mm (40) For my FIRST attempt I screen printed a fine pitch water solub
Electronics Forum | Wed Mar 29 09:31:28 EST 2000 | Erick
Marc: My experience found reliability IS a function of operator skill and attension to the process. Expecially for some RF assemblies. I worked with an engineer from Rogers to develope a process for reworking Pads for a special material. (I thing
Electronics Forum | Wed Mar 08 17:01:32 EST 2000 | Russ
So far, I have not been able to get any consistant or good results using one of these "problem solvers". I have managed however, to screw up some good processes. I believe that this technology can work though. I would reccomend contacting Speedlin
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Mon Feb 19 14:17:21 EST 2001 | bschreiber
Hi Mark, If you are a user of stencils, you already know that there are literally hundreds of stencil manufacturers out there. If you found one that will allow such hot temperatures, I would be interested in learning who it is. However, I have only
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Tue Mar 20 20:12:32 EST 2001 | davef
In response to a similar question Dennis Fritz [DDFRITZ@AOL.COM] Chair of the Alternate Final Finishes Committee of IPC (5-23d) said ... The Alternate Final Finishes Committee of IPC (5-23d) has nearly completed a round robin "conditioning" study of
Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra
RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr
