Electronics Forum: 2.. (Page 499 of 1147)

GSM1 occasional fault

Electronics Forum | Tue Jan 26 05:42:56 EST 2010 | dilogic

Our GSM1 with Flex2 heads started to generate occasional error message: "Axis head 1 theta positive lead error during move absolute command" and then stop. After palm-down it runs again for some time. Everything looks fine, so I have no idea where

Fuji FCP-IV-2 error

Electronics Forum | Tue Feb 16 08:47:38 EST 2010 | jdengler

We powered up our CP-IV today and got an error. About 7 seconds after power on page 000 comes up with nothing in any of the areas except for second status area which contains "LD INIT" in yellow. After about 16 seconds the second display area gets

Toyota sticking pedals recall is a smokescreen

Electronics Forum | Fri Feb 26 10:39:03 EST 2010 | patrickbruneel

A recalled Toyota Corolla went straight through the front door of a home in Georgia. Pretty much like the professor simulated but in real life. This was a recalled vehicle so evidently the pedal theory might be incorrect. http://www.cnn.com/video/

Strange things ocuring during reflow...

Electronics Forum | Wed Feb 24 19:51:12 EST 2010 | dcell_1t

Hi! Just to update... we checked along with solder paste suplier and found that the curtain on the oven was probably causing the issue so we removed in order to troubleshoot, as far as I know this curtain helps to not allow to flow oxygen into the ov

BGA

Electronics Forum | Thu Feb 25 10:54:03 EST 2010 | duanebrayton

We are a small Contract Manufacturer and have received a project which has BGA's on top & bottom. 2 larger BGA's on one side (~_20x20mm) & 3 smaller BGA's (~_8x8mm) on the other. we plan on running the side with the smaller BGA's first but need som

Stencil Printing

Electronics Forum | Mon Mar 08 21:53:48 EST 2010 | aungthura

We have been using a manual printer for both epoxy and solder paste.Now, our buyer asked us to replace it with 2nd hand SMT SL 2220 stencil printer.Our board size is usually 450x550mm and thousnds of compenents.I want to know that some1 has used this

Solder void underneath the mosfet

Electronics Forum | Wed Mar 24 11:09:44 EDT 2010 | rajeshwara

Hello Sir I faced the same problem for QFP in DTH product in India. IPC stated that void should not be more than 25% of solder joint. But this type of void definatly create problem during functional test. Please check the folloeing point... 1.Check t

Multilayer PCB X-ray inspection

Electronics Forum | Mon Apr 05 17:47:21 EDT 2010 | boardhouse

Hi Deni, X-ray will not be able to see through Power and Grn planes. Your only way to find out is: 1) ask your board supplier to supply stack up used. 2) surface grind layer by layer to validate if it is correct stack up. What is making you think

To reduce the dross formation in wave soldering process

Electronics Forum | Thu Apr 15 10:09:55 EDT 2010 | davef

Dross formation rates for SnCu and SAC are roughly 2.5 times the rate for SnPb (Hwang et al., 2004) Methods for reducing dross are: * Lower pot temperature * Run pump speed slower and only when soldering * Check solder contaminants to BS219, ASTM

I need an Oven

Electronics Forum | Fri Apr 16 12:23:40 EDT 2010 | shawnvike

We are looking at buying a new (or used) oven for low-mid volume Pb-free production. I have looked at the smaller Hellers, BTU, vitronics, etc. and I am also looking at the Manncorp CR-6000. I want at elast 5 zones, top and bottom, air (no N2) pi


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