Electronics Forum | Mon Nov 19 15:21:44 EST 2007 | wayne123
I was not trying to imply that you didn't know how to run these machines I was simply saying that alot of problems that people may encounter can be solved with operating them correctly, I am sorry if you took offense to this, I too have performed all
Electronics Forum | Sat Nov 17 18:29:02 EST 2007 | bbarton
Let's face it guys...in most cases (stress the MOST!) a typical FR4 board will do the job. Few layers, low copper, not too densly populated etc...no worries. Use a reflow profile which avoids the 245-250C range, use a shorter TAL, Viola you have a go
Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef
Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree
Electronics Forum | Tue Nov 27 20:19:12 EST 2007 | davef
Q1: How many mils the gap between the terminal and pad? A1: It depends on properties of the glue and z-force when the component is placed by the assembler. Q2: Your practice is for technology SMT-4? A2: We don't understand SMT4. We know that very sm
Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Thu Dec 20 23:56:35 EST 2007 | isd_jwendell
I run a prototype/small-run shop, so I'll include some recommendations too: 1) Don't buy a machine for just what you are doing today. Once you get into this field you will find demand to do more. 2) Don't scrimp on the stencil & machine. You will spe
Electronics Forum | Wed Dec 19 22:32:03 EST 2007 | davef
Nerdyboy don't write no blanking program. Get two extra carriers of the same size and configuration as the low temperature carrier that you want bake at a higher temperature. One of the these extra carriers needs to be high temperature material that
Electronics Forum | Wed Jan 23 11:28:47 EST 2008 | tbkonrad
Help! Since last Friday i have been having issues with a Quad qsv-1, it all started with a quad align error, i found there to be a small quantity of grease covering the lenses on both quad align sensors. I wiped the grease off and then everything s
Electronics Forum | Fri Feb 01 16:11:08 EST 2008 | operator
They have been having a lot of fallout and they believe it is one of the BGAs that is causing it. I tell all my customers that it is better to stay away from baking if possible and to practice proper storage techniques. But the thing is they insist o
Electronics Forum | Sun Feb 24 19:10:17 EST 2008 | larryd
Skill and experiance level of assemblers is critical. High skill and experiance with the type of assembly, print and BOM and hgihlighters. Day labor would be 5 to 10 components for each assembler, already prepped with pictures or drawings showing wh
