Electronics Forum: stencil (Page 502 of 540)

Availability of GRID-LOK

Electronics Forum | Mon Jul 30 12:41:47 EDT 2001 | hinerman

1. Realizing not all PCBs will be warped, but for those that are, the tooling can be set when the board is in contact with the stencil, which will take out some warp. On an MPM, the vacuum box helps to hold the board flat If the warp is more sever

Re: Via-in-pad

Electronics Forum | Sat Jan 22 20:59:51 EST 2000 | Jeff Sanchez

Michael, I am not sure if you are trying to lay out a board with vias in the pads or suffer through an assembly you got stuck with? I am building run of boards right now that has vias in most the smt pads. I'm sure the design group thought it was

Re: Paste Question!

Electronics Forum | Thu Jan 06 17:56:14 EST 2000 | Brian W.

I agree with Dave that passte volume is the most preferable criteria. However, you need to determine what you will accept and what your process is capable of. You need to define the process parameters, put procedures in place to control them, reduc

Re: Solder Wetting

Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup

Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the

Re: Solder Balling Beading Effect

Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron

Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu

Re: Noclean soldering to gold

Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ

Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to

Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William

All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join

Re: IQ/OQ, and PQ

Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F

I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha

Re: 0201 components

Electronics Forum | Wed Sep 15 19:01:39 EDT 1999 | DGrenier

I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). Can anyone direct me to any other supplier? Are there any particular problems associated wi

Re: PCB Component Legend Under SMT Pad/Land

Electronics Forum | Mon Sep 13 09:49:16 EDT 1999 | John Thorup

I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects o

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