Electronics Forum | Wed Aug 31 11:40:24 EDT 2005 | stepheniii
I just had a "how could I have forgotten" moment. By any chance are these double sided boards and the cracked components are on the fist side? If so support pin placement could be the problem. In case more info would be good.
Electronics Forum | Wed Jan 18 02:00:36 EST 2006 | pavel_murtishev
Good morning, This isn�t very strange. Bottom side components are prone to tombstoning more than topside ones. Try to reduce oven�s bottom heaters temperature slightly to prevent solder paste melting on bottom side. This can help. BR, Pavel
Electronics Forum | Wed Mar 08 17:51:27 EST 2006 | pms
Chunks nailed it. You should not expect to see a perfect side fillet on this part, especially using no-clean, it's probably bare copper, hard to wick solder up the side of the lead.
Electronics Forum | Thu May 25 11:09:58 EDT 2006 | John S.
This is a very competitive market segment. We setup 3 of them side by side at the same time on a demo basis in our facility. Work with them as much as you can, and setup an objective test of their capabilities. Good luck. John S.
Electronics Forum | Wed Jun 14 16:27:13 EDT 2006 | vikkaraja
Talk to Fuji regarding this issue, there is retrofit kit for the mark read camera amp.( it's black color box on top of the machine from side one on your right hand side). And also check you software there might be upgrade available from fuji. I hope
Electronics Forum | Mon Jun 19 21:53:10 EDT 2006 | WEEEsted
Try using the loctite(glue) during the top side process. Other way is to separate bigger component IC on the last process (top side).
Electronics Forum | Tue Aug 29 21:14:45 EDT 2006 | Bubba
You need a machine with side clamps. DEK makes them. MPM makes them. Look into a retro for your machine. Both take up space on top of your board. Be carefull of top side component clerance if switching.
Electronics Forum | Tue Sep 05 06:23:19 EDT 2006 | jonatf
Hi guys, I want to improve the set up of our printing machine(EKRA) especially on a 0.5mm thickness double sided boards.I find the support pins very time consuming.. any advice?? thanks.
Electronics Forum | Sun Dec 17 23:22:17 EST 2006 | bigdaddysoy9
If you are talking about a chip capacitor, then I think it's 50% (of component width) side to side for class 1 and 2. And 25% for class 3. There is no end overhang permitted for all 3 classes.
Electronics Forum | Fri Feb 23 15:31:31 EST 2007 | realchunks
Running the BGA first is OK. We run double sided BGA baords all the time without problem.
