Electronics Forum: design (Page 505 of 537)

Re: PCB panellisation

Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley

| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati

Re: PCB panellisation

Electronics Forum | Sun Apr 05 14:57:10 EDT 1998 | Earl Moon

| | | | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utili

Reflow Specs.

Electronics Forum | Mon Aug 13 21:04:15 EDT 2001 | davef

What??? You don�t have enough things to monitor? The origin of some profiles is mysterious. It�s probably good to try to understand such mysteries. Certainly, the important determinants in the design of your reflow profile are: * Paste you�ve sel

Removal of No-Clean flux residue

Electronics Forum | Thu Sep 06 10:34:21 EDT 2001 | Mike Konrad

Hi Jeff, Sean is correct. Although ultrasonic technology will work in post-reflow de-fluxing applications, you will receive concerns regarding ultrasonic �damage� to wire bonded components. Much has been written to combat this belief but the conce

Placement Program Tweaking

Electronics Forum | Fri Oct 19 17:41:21 EDT 2001 | Stefan

I used to love tweaking. I tweaked and tweaked until I got a master degree in tweaking. But than I had to teach others how to program a board and avoid tweaking. After all it does not go quite conform with ISO and other quality approaches. I investig

First piece inspection

Electronics Forum | Wed Jan 09 20:40:58 EST 2002 | ianchan

Since we are on the topic, What we do over here, is to get SMT Technical to machine pick&place "sample component layouts" onto double-sided tape, which in turn is placed onto an actual PCB... QA will take that double-sided tape sample, and using an

Stencil Cleaner

Electronics Forum | Thu Mar 28 16:00:31 EST 2002 | bschreiber

Hello Dave, Water Washable (Organic Acid, OA) post solder flux residue is designed for cleaning in plain water without cleaning chemical additives. The real advantage of water washable flux was that it cleaned in plain water without additives � no

stencil printing parameters

Electronics Forum | Wed Mar 27 16:54:47 EST 2002 | davef

STARTING RANGES * Pressure � 1 pound/inch of blade (metal); 1.6-3 pound/inch (plastic) * Speed - 0.5 to 3 inch per sec [for standard pitch]; 0.5 to 1 inch per sec [for fine pitch] Your paste supplier�s recommendation is a good place to start. * Sepa

Moisture Barrier bags

Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette

Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti

AXI and AOI

Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc

When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A


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