Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef
bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip
Electronics Forum | Fri Aug 08 08:34:28 EDT 2003 | mleber
Problem areas are always ground connections. 20 pin dips have great flow on 18 of 20 pins, caps have poor upflow on the ground side only etc. That's my problem. 90% of the pwb looks great. Bottomside - awesome. Ground connections do not meet the 75%
Electronics Forum | Wed Aug 13 15:29:27 EDT 2003 | caldon
DUDE!!! The RS 64-2187 model: Select 230 watts (up to 11000F) for soldering metals such as copper, tin or brass. -Choose 150 watts (up to 9500F) for electrical, hobby, general soldering - One-finger, dual-heat trigger switch squeeze to first positi
Electronics Forum | Thu Aug 14 16:36:45 EDT 2003 | Hussman
Anyone using these 2010 resistors? We just tried them and they bow like crazy during reflow. Not very good looking. Profile meets manufacturers spec. The part solders and works fine, but I'm a little concerned about putting anything on a board th
Electronics Forum | Thu Aug 21 23:35:20 EDT 2003 | kennyg
For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process
Electronics Forum | Wed Aug 27 09:45:22 EDT 2003 | caldon
My initial thought (Quick and not to in depth)made me think of the solder joint integrity. I would fear solder contamination if the metal making up the plating would leach (or its elements) into the solder joint. I strongly suggest if you were to go
Electronics Forum | Wed Oct 01 13:39:13 EDT 2003 | arturoflores
They take the solder in a dip and look solderability test but when in normal reflow process we got some pins that do not get wet and the appearance is as follows: -Pillow effect on the toe(no front fillet is formed) -There is a sheet of flux between
Electronics Forum | Mon Oct 13 15:34:22 EDT 2003 | John
Anyone ever noticed a difference in measuring the temperature on a soldered board vs. using an unsoldered mole in their wave? I've been looking at the temperature of a specific part, and it reads much higher on an unsoldered mole vs. a soldered mole
Electronics Forum | Tue Oct 21 23:28:59 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Tue Oct 21 23:29:08 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
