Electronics Forum | Mon Aug 13 21:04:15 EDT 2001 | davef
What??? You don�t have enough things to monitor? The origin of some profiles is mysterious. It�s probably good to try to understand such mysteries. Certainly, the important determinants in the design of your reflow profile are: * Paste you�ve sel
Electronics Forum | Thu Sep 06 10:34:21 EDT 2001 | Mike Konrad
Hi Jeff, Sean is correct. Although ultrasonic technology will work in post-reflow de-fluxing applications, you will receive concerns regarding ultrasonic �damage� to wire bonded components. Much has been written to combat this belief but the conce
Electronics Forum | Fri Oct 19 17:41:21 EDT 2001 | Stefan
I used to love tweaking. I tweaked and tweaked until I got a master degree in tweaking. But than I had to teach others how to program a board and avoid tweaking. After all it does not go quite conform with ISO and other quality approaches. I investig
Electronics Forum | Wed Jan 09 20:40:58 EST 2002 | ianchan
Since we are on the topic, What we do over here, is to get SMT Technical to machine pick&place "sample component layouts" onto double-sided tape, which in turn is placed onto an actual PCB... QA will take that double-sided tape sample, and using an
Electronics Forum | Thu Mar 28 16:00:31 EST 2002 | bschreiber
Hello Dave, Water Washable (Organic Acid, OA) post solder flux residue is designed for cleaning in plain water without cleaning chemical additives. The real advantage of water washable flux was that it cleaned in plain water without additives � no
Electronics Forum | Wed Mar 27 16:54:47 EST 2002 | davef
STARTING RANGES * Pressure � 1 pound/inch of blade (metal); 1.6-3 pound/inch (plastic) * Speed - 0.5 to 3 inch per sec [for standard pitch]; 0.5 to 1 inch per sec [for fine pitch] Your paste supplier�s recommendation is a good place to start. * Sepa
Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette
Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti
Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc
When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A
Electronics Forum | Thu Aug 01 13:04:57 EDT 2002 | gdstanton
Its interesting. It appears I'm getting conflicting feeback from Indium. This says its not a problem... http://indium.custhelp.com/cgi-bin/indium.cfg/php/enduser/std_adp.php?p_sid=kTDKGClg&p_lva=&p_faqid=355&p_created=1014734692&p_sp=cF9ncmlkc29
Electronics Forum | Sat Sep 21 06:27:22 EDT 2002 | matherat
Wow, this has been real interesting reading. Kind of like a Jerry Springer Forum. "Today on SMTA Forum, cranky engineers and over zealous sales people square off to decide if the replies to the thread are appropriate" When some one asks a questions
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