Electronics Forum | Mon Jun 14 11:00:50 EDT 2004 | raylawre
This is one reason why we changed package styles. Maybe consider getting a different size tube, say from 500g to 1000g or something like that. We use jars for lead paste, and tubes for lead free (different application method) If lead free comes off t
Electronics Forum | Thu Jul 22 07:52:37 EDT 2004 | Chris L.
Hi Grant, The purpose for allowing the solder paste to reach room temp before production is to reduce the amount of water absobtion from the air. (e.g. a cold glass of water "sweats" on a humid day)The purpose for mixing is to make the viscosity more
Electronics Forum | Mon Nov 01 16:33:50 EST 2004 | bschreiber
Smart Sonic has an entry level component to our StencilScan AOI system called the Assembly Module GT. The Assembly Module GT is low cost and will get the job done. Plus, the Assembly Module GT can be upgraded easily to the other Assembly Module pro
Electronics Forum | Thu Sep 02 15:45:35 EDT 2004 | russ
We don't do any wave, SMT only. We did not have to change apertures for lead free, we use the same stencil that we did when we ran water soluble with pb. This I think might be dependant upon your current design of both pad and apertures however.
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron
Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da
Electronics Forum | Thu Jan 06 06:15:49 EST 2005 | mattkehoe
We need some opinions about a situation that is causing problems in our process. The pcb's in question are .125 thick with a HASL finish. The boards are coming in with a large amount of solder trapped inside the via holes. Sometimes this solder is ac
Electronics Forum | Tue Jan 25 09:15:02 EST 2005 | Marc A
Good info, thanks for passing along. The company I work for (equipment supplier) ran some tests with lead free material in air and N2 environements for reflow. In the air reflow environement it was noticed that the material does not spread, much li
Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS
First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the
Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS
We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of
