Electronics Forum: bga's (Page 508 of 546)

BGA void removal

Electronics Forum | Sat Oct 19 08:33:50 EDT 2002 | johnw

The whole thread seem's to have gone off track. Russ we've been doing a fairly big bit of work on the whole BGA voidign thing as we were so unhappy with the answer's that we were getting from around the industry, basically no one really kows all the

Cleanliness test

Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard

Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C

BGA and QFP orientation in trays for pick and place

Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith

BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou

Cleaning Water Soluble Flux under BGA's

Electronics Forum | Thu Mar 25 12:20:21 EST 2004 | Mike Konrad

OK� Nap time�s over! Technically speaking, water soluble flux is just that, soluble in water. Technically speaking, one does not need a saponifier or any other chemical agent to remove water soluble (OA) flux residues. However, one must conside

Stencil cleaners.

Electronics Forum | Mon Jul 24 15:10:37 EDT 2006 | carln

Here are some additional comments that have been posted on the CircuitNet web site: Fist, the answer is the same regardless of the specific paste type, (leaded or non-leaded). High pressure sprays should never be applied to a stencil. Stencils are

How to choose a new solder paste

Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp

Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux

01005 Qualifications - Lead Free

Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem

Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:50:01 EST 2000 | Dave F

Mike: It gets more humid in the winter? [I can see it�s true (not that I�d doubt you) cause I�m looking a a humidy map of the USA, right now] How does that work outin Californy? [Do the ocean breezes move the humid air in-land in the summer? Er w

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker

Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F

Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca


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