Electronics Forum | Wed May 25 23:45:04 EDT 2022 | SMTA-64387687
1. The jetting head flies very low to the level of the board. So, performing AOI function will crash the head. 2. AOI is performed close to the end of the line, after P&P or reflow. Are you planning to run the boards back-and-forth, on the line? 3. L
Electronics Forum | Fri May 27 12:34:20 EDT 2022 | SMTA-64387182
On my PCB fab drawings, I specify SOLDER MASK PER ANSI/IPC-SM-840, should I specify a CLASS rating? It appears at one time the CLASSES were 1, 2, or, 3. I believe, they are now T or H. Correct? Thanks, Joe
Electronics Forum | Mon May 30 11:46:51 EDT 2022 | jojoled
You were right, that helped.....So If I enter all the data in "Compopnent dat" or Feeder data".....You can not delete any of that. If you want to delete anything unused, You have to be in Component data, then go to sub-menu : List Components, and del
Electronics Forum | Tue May 31 08:04:01 EDT 2022 | bukas
Hi, I am searching for a CMMS that will help me organize maintenance and calibration works. What do you use and what are your experiences? Some programs I saw out there are quite detailed and complex in some aspects of maintenance but lack some thing
Electronics Forum | Wed Jun 01 04:31:30 EDT 2022 | ttheis
This is a 0603 ceramic capacitor. Thanks for the tip; this helped us figure out the issue. We reduced lighting and saw an improvement but still had issues. Looking closer at the rejects (see pic#2 in original post) there were some shiny spots on the
Electronics Forum | Tue Jun 07 19:05:52 EDT 2022 | duchoang
First Article Inspection is always a MUST in SMT Process. If possible AOI would be added. We also have second operator/inspector to check on pick&place machine setup and use a program printout for inspector to compare/double-check with BOM and the ot
Electronics Forum | Wed Jun 08 03:09:44 EDT 2022 | pradeep14
Thank you. In our organization also we are following loading verification before starting the placement. But i want know before starting the placement during NPI/Proto Build, what are the system need to be followed to cross check with Pick & Place pr
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
Electronics Forum | Thu Jun 09 11:13:41 EDT 2022 | proceng1
In Microsoft Excel, you can set up a formula to compare two columns of data, and tell it what to do if it finds duplicates (like turn the cell green) and if it finds non-duplicates (turn the cell RED) so you can quickly compare two sets of data that
Electronics Forum | Fri Jun 10 13:54:01 EDT 2022 | davef
Solder connections to the castellated and other components need improvement. Are you profiling on the problem leads? Microchip Technology Inc. RN4678 Bluetooth module reflow recommendations - http://ww1.microchip.com/downloads/en/DeviceDoc/RN4678-Bl
