Electronics Forum | Mon Mar 08 05:03:24 EST 2010 | grahamcooper22
Hi, I fully agree with isd.jww. The difference in the solder joint appearance of the 2 joints highlighted could be down to a few reasons...reflow profile (I know you've checked, but have you stuck a thermocouple on this actual joint ? ), contaminatio
Electronics Forum | Tue Sep 18 21:37:06 EDT 2012 | vergara1
Hi Manoel, I want to make sure I understand what you are talking about; reading the reply,along with your replys it almost sounds as if we are not talking about the same thing. In your picture I'm seeing a SMT diode correct? You are talking about th
Electronics Forum | Mon Jul 24 22:50:43 EDT 2017 | dawson
In fact, we can solve this problem easily. AOI only check whether the IC is soldered well. But we can ask our technician to make a test first to control the reflowing temperature and time. 1. using tool to test the temperature between the bottom IC
Electronics Forum | Thu May 03 17:33:20 EDT 2018 | dleeper
Solder paste selection can have a huge impact on size and quantity of voids. Talk to a few suppliers and ask for their recommendation on low voiding formulas. Pick a few of your top candidates and then perform a DOE to see who has the best result. S
Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson
| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are
Electronics Forum | Thu Oct 09 11:57:14 EDT 2008 | hussman
Why not build with a leaded paste or solder pot? You'll have more than 3% lead after solder. Who cares about before solder - any testing will be done on the finished product.
Electronics Forum | Wed Aug 18 11:12:04 EDT 2010 | davef
So with your mounting frustration in your inability to zero-in on the factors that drive your solder balling, are you thinking that maybe you need to bite the bullet and design a experimental study to help isolate the key drivers to your solder balli
Electronics Forum | Thu Apr 20 21:45:10 EDT 2000 | Dave F
Wister: Oooo, I understand now what you mean by "an open." Sorry, I was (am) a bit dense. Your hypothesis is reasonable. On the other hand, have you looked at the traditional causes of tomb stoning also? For a defect to be a "tomb stone," it doe
Electronics Forum | Tue Dec 14 08:01:14 EST 2004 | paul_fisher
Our paste is no new we have used it before [Cobar no-clean paste]. The solder joints look like they are bursting out salty looking crystals. Maybe the board cleaning is a red herring in that if the boards are clean it stops this crystalisation travel
Electronics Forum | Thu Mar 06 22:34:55 EST 2003 | davef
O' Connor: Are you saying that: * You solder fine in the areas where you print paste * You solder poorly in the areas where you don't print paste Aside from that, the gold on these pads seems to be less bright than previous lots. [if that's not it
