Electronics Forum | Wed Jul 15 08:25:22 EDT 1998 | Dave Kalen
| Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment you are
Electronics Forum | Thu Jul 16 12:50:57 EDT 1998 | joe devaney
Dave, We have a rigging company that uses what we call airbags, the same principle like and upside-down air hockey puck. We have moved Fuji machines, verticle carousels (fully loaded with parts), reflow ovens etc. and wouldn't move another machine
Electronics Forum | Tue Jun 23 13:33:23 EDT 1998 | Ben Salisbury
| Ben: Nice answer, but what's a DOE? How do you run one? What other processes do you run DOEs on? Dave F DOE=Design of Experiment Tools used for DOE...Multi-Vari Charts,components search, Pair comparisons, Variables search,Full Factorials, B vs.
Electronics Forum | Thu Jun 18 21:19:17 EDT 1998 | Dave F
| I am currently using some pick & place equipment and would like to measure their cpk using a glass plate and glass "components" with vernier scales. I have seen these kits but am trying to track a supplier down in UK/Europe. | Any help is much appr
Electronics Forum | Sat Jun 27 20:16:20 EDT 1998 | Chris Haynes
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F SRT makes
Electronics Forum | Wed Jun 03 18:19:45 EDT 1998 | Earl Moon
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F Dave, Wha
Electronics Forum | Fri May 29 16:07:55 EDT 1998 | Steve Gregory
| | Thanks Steve- | Here is the whole story: | | The solder balls are appearing all over, similar to a | splatter. They are relatively small. We are using H-Technologies | S-HQ no-clean solder paste. The stencil is 6 mil and the boards | are ru
Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis
There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. | R&D is currently designing a board with smt components on both sides of the bo
Electronics Forum | Tue Jun 02 17:59:01 EDT 1998 | Dave F
| I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | Earl Moon What methods do people use to dress pads after removing and before replacing the
Electronics Forum | Sun May 31 15:57:51 EDT 1998 | Allen
I came across your question and have a good reply for you: We have been using a system to reball our BGA's made by a company called Galahad. They have been working with Hepco for distribution. Give them a call at 408-738-1880. The system is around
