Electronics Forum: seeing (Page 513 of 725)

hot air rework station / solder paste

Electronics Forum | Fri Nov 17 16:24:18 EST 2006 | billwestiet

I'm in North Attleboro, small world. To answer your question, you can deposit small dots of paste with a syringe. Kind of tricky work, and there are small stencil soluions out there fairly inexpensively. See http://www.minimicrostencil.com/ (I do

SMD flatness standard

Electronics Forum | Sat Nov 18 21:20:58 EST 2006 | Fer

Dave, May I ask where did you find the 1.5%, or the goal of .005" (or .007") per inch? The IPC-A-600 bow and twist standard calls for a .75% based on the calculation of the test method TM-650, method 2.4.22, which calculates the percentage based on

Chinese Wave Solder Machines

Electronics Forum | Mon Nov 27 16:52:18 EST 2006 | greg york

Hi Bill Mostly in the UK, but originally saw the problem when I helped on one install in Malta on a chinese mc set at 5 degrees and had nightmare bridging. changed the angle to 6.5 ish and results were instantly better actually better than what they

ENIG or flash?

Electronics Forum | Tue Nov 28 17:23:03 EST 2006 | flipit

Flash gold usually refers to electrolytic gold with a short plating time. In other words gold plating that requires current to plate. If you have bare copper under your soldermask, the gold is probably ENIG. The only other way to have bare copper

Smt 'pick and place' machine issues

Electronics Forum | Wed Nov 29 01:09:17 EST 2006 | Guess

I would suggest checking the feeder, MVF and MSR are both turret type and dont have the capability auto pik adjust in y. Y offset pick up would lead to : 1. Over turn component. 2. Missing component. Turret sequence is pick, recognize an

Flux residue cause high false reject at ICT

Electronics Forum | Thu Dec 07 10:05:18 EST 2006 | Learn from U

Hi all, Sorry for the late reply..I am sure it is flux residue..Found no such symptom as Grey mention above. This is non clean process and no way we can clean this whole big board(Server) with any kind of flux removal...Currently, the ICT probe pre

Solder beads on small caps and res.

Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo

I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most

Ways to control SMT gap to PCB

Electronics Forum | Thu Dec 07 19:20:28 EST 2006 | ganoi

Most likely there is movement during reflow. How about conduction oven over convection oven for reflow? This is a small PCB with the LED sitting on a Flex-Rigid extension from the PCB. I was thinking if the stencil aperature for the LED was to be cu

Lead Free Squirt Bottles

Electronics Forum | Tue Dec 19 12:14:47 EST 2006 | realchunks

Hi Darby, No, I'm not cutting on the robot guys. I actually went thru their site and found it interesting. They truely use their knowledge and creativity, which is a rare thing to find these days. That, coupled with their common sense and resourc

QFNs (LCCs)

Electronics Forum | Thu Dec 21 15:11:53 EST 2006 | billyd

Hey fellas. Listen, I'm trying to see what the industry as a whole is doing with regard to placement and reflow of the tiny QFN devices. Not the larger ones, but the 4mm or 5mm ones. We struggled a bit with a QFN24, 5mm square. The thermal pad undern


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