Electronics Forum | Fri May 26 16:24:45 EDT 2006 | Jak
Due to spacing issue, we are considering using power bricks with tin/lead solder ball instead of PTH package. The solder ball is 40 mil diameter. Our CM suggested they do hand place since the pick and place nozzle cannot pick up and hold the part due
Electronics Forum | Wed Jul 12 14:29:10 EDT 2006 | russ
i agree and I think we all do that the BGA is more robust in processing, BUT we forget that it is 3 dollars more per assy!!!!!!! It would take a very poor process to warrant 3 dollars per assy. If you can't place a QFP to this level (takes 3 dolla
Electronics Forum | Mon Sep 11 03:52:14 EDT 2006 | aj
Hi All, this has not happened but I would like to know what the possible effects would be if we ran a non-rohs pcb (hasl) thru a leadfree Process. We have a customer who cannot confirm if the board is rohs compliant or not and we are waiting on con
Electronics Forum | Tue Nov 21 13:25:25 EST 2006 | jax
Depending on Zone Temperatures, Belt Speed, and Board Density... Some Convection Ovens will drop Zone Temperatures faster than others. They recover by increasing Air Circulation. This can make parts fall off the Bottom-Side that otherwise would
Electronics Forum | Tue Dec 05 03:39:39 EST 2006 | pavel_murtishev
Good afternoon, Due to problems with power connector soldering I have to overprint paste on pads for this connector. Stencil thickness is 125um and I cannot make it thicker. Area ratio of chip resistor assemblies limits stencil thickness to 125um. R
Electronics Forum | Wed Jan 03 10:41:47 EST 2007 | Rob
Consider this: The inner balls will be at a lower temperture than the outer balls in reflow, so if you cannot inpsect them then that may be where your problem lies. Are you reworking with a specialist machine that is directing the right amount of h
Electronics Forum | Tue Jan 23 17:32:53 EST 2007 | russ
if you cannot spend any money I would say that you either need to add rails or try to increase the squeegee pressure to hold down the stencil while it prints those close pads. But...... Can you put PCB onto some type of carrier that would move thes
Electronics Forum | Sat Feb 10 20:08:25 EST 2007 | colormaker
I just started a design where I will be placeing smt parts on both side of PCB. 50 parts on top side ranging from 0602 to SOIC8 and 4 SOIC LED's on bottom. How can I assemble with parts on both sides ? I have P&P,stensil printer, relfow and solder w
Electronics Forum | Tue Mar 13 00:02:45 EDT 2007 | grantp
Hi, That's great, and there are better ways to advertise, such as banner adds, and trade shows etc. You also have no idea who I am and cannot just blow be off as someone young, as you did, so you can understand why that's annoying. Good luck with
Electronics Forum | Fri Mar 09 06:04:18 EST 2007 | phil69
Hi, I am currently looking for a replacement solvent to remove RMA flux from Hybred Ceramic Substrates after reflow. We are currently using Dichloromethane in a Crest AVD500 wash. This solvent carries an R40 risk phrase, hence we are on a drive f
