Electronics Forum | Sun Apr 29 15:43:38 EDT 2001 | davef
Call me wet behind the ears!!! I'd kinda like to see you refine your processes on your products before you go-out drying-out your ears on someone else's products. The worst contractors in the world seem to be those with their own product lines and
Electronics Forum | Thu Oct 26 14:40:12 EDT 2000 | ptvianc
Hello: I have not seen a published formula for calculating the package weight that can be secured by molten solder. I have seen forumlas printed for tombstoning. From that aspect, we developed the following rule-of-thumb for first-order estimates:
Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee
The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell
Electronics Forum | Fri Jun 22 11:54:47 EDT 2001 | jdtpfacreate
OEM Boy, This is an excellent question. Since I am on the "I-want-to-sell-you-equipment-side" I do not have the hands-on experience that you do but, I do have a many engineers back at our factory who have dedicated their lives to these issues.
Electronics Forum | Tue Jan 11 10:01:30 EST 2000 | Wolfgang Busko
Hi Pat, we had white tin boards laying around for about 10 month with no extra protection than the plastic bag that they were shipped in. Never thought of using them for there was a relayout planned to fix some serious bugs. But that�s life, relayo
Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra
At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and
Electronics Forum | Mon Dec 13 05:43:27 EST 1999 | Wolfgang Busko
Hi Steve, 20 mil pitch shouldn�t be that problem nowadays. In your case bridging and poor wetting seem to go hand in hand. For the poor wetting try to eliminate it by using different paste (higher activated) and work on your profile. Coplanarity also
Electronics Forum | Wed Aug 18 21:25:37 EDT 1999 | Tony Yang
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Wed May 12 20:43:53 EDT 1999 | Earl Moon
| Folks, | I am interested in knowing what level of Nitrogen purity you are running in your reflow ovens for standard SMT assembly? | It seems over the last several years people are increasing the Oxygen level in thier reflow oven atmosphere. | What
Electronics Forum | Mon May 03 09:42:45 EDT 1999 | Mike McMonagle
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
