Electronics Forum | Tue Oct 21 10:57:15 EDT 2008 | arosario
Hi Dave, thanks for the info. I'll check the detail and try to send sample SMD's for test. - Bong
Electronics Forum | Tue Oct 21 11:19:30 EDT 2008 | ljohnson
Sounds to me like your printer not releasing paste now and again. How can you be sure that you are not getting print skips. Are you using any kind on AOI?
Electronics Forum | Mon Apr 13 12:32:55 EDT 2009 | ericthered
That would be great Armando, thanks. Also, what changes might I make with metal clad light boards (LED). heat transference is tricky with these and the solder is not wetting well.
Electronics Forum | Tue Jul 14 22:08:02 EDT 2009 | magnifico
Thanks Sr. Tech! To Daxman, Do you use Alvania#2 as well (in combination with TFL-50)? Furthermore, when purchasing TFL-50 wet lube, do you normally pay for the shipment, dangerous goods packing, etc? Thanks a lot!
Electronics Forum | Mon Aug 03 04:51:58 EDT 2009 | lococost
From alpha metals lead free alloy impurities bulletin: "Levels greater than 0.025% may start to slow the wetting speed and could affect the hole fill performance. If process performance is OK then levels up to 0.05% are OK."
Electronics Forum | Thu Sep 03 02:38:00 EDT 2009 | sachu_70
Does the established joint still exist if once again re-touched by a soldering iron, or does it return to the original problem? Wetting issues on pad could be for many reasons and you could analyze with a cause effect diagram.
Electronics Forum | Mon Sep 14 17:05:58 EDT 2009 | davef
Glycols, polyglycols, polyglycol surfactants, polyethers, and glycerine are used in water-soluble flux formulations because they provide excellent wetting of the board surface and dissolve the more active materials used in these formulations. [Printe
Electronics Forum | Mon Mar 01 09:17:56 EST 2010 | duso02
Hey....I think it might be the silicone adhesive! LOL Yeah, that'll do it. We use simple Shercon paper dots. Work like a charm. No evidence of "de-wetting".
Electronics Forum | Tue Mar 16 16:59:09 EDT 2010 | davef
Most often 'solder graping' refers to poor solder wetting, where the solder paste has partially melted, but has not coalesced or flowed. Sometimes this leaves the outline of the partially melted solder balls still visible, giving the appearance, to
Electronics Forum | Fri Jun 25 05:34:40 EDT 2010 | ppcbs
Hi iv40 Try with NIC ceramic capacitor that was tested in wet process. We hav succeed with these cap after we found some failure with Kemet ceramic Cap which tested in dry test process while manufacturing.
