Electronics Forum | Wed Nov 07 10:30:19 EST 2007 | grantp
Hi, I did an interesting experiment today, when we had some government people in our factory to visit us. I mentioned that we went lead free well before the deadline, and it's nice none of our people need to handle anything with lead content, (they
Electronics Forum | Wed Nov 07 11:27:28 EST 2007 | patrickbruneel
Grant, Thanks for sharing that experience with us; this comes to show what damage can be done when politicians make laws based on rumors instead of facts. New laws as drastic as removing lead in soft soldering should have been based on scientific e
Electronics Forum | Thu Nov 08 07:33:23 EST 2007 | hussman
Why? Just use IPC on finished solder joints as your guide. I've seen groups of people puts hundreds of hours into this task and then tell me a 3 mil stencil is all I need. After reflow, none of the solder joints meet IPC Class 1 and a lot of tombs
Electronics Forum | Mon Nov 12 09:37:17 EST 2007 | russ
You need to perform process a capability study prior to putting these controls into place. Cleaning a stencil after each pass will get ugly, solvent residues remaining in apertures etc. 2D inspection is good. Change paste every hour will get very
Electronics Forum | Mon Nov 19 15:21:44 EST 2007 | wayne123
I was not trying to imply that you didn't know how to run these machines I was simply saying that alot of problems that people may encounter can be solved with operating them correctly, I am sorry if you took offense to this, I too have performed all
Electronics Forum | Fri Nov 16 08:47:04 EST 2007 | rgduval
Fractured parts that we've seen at reflow in the past are related to trapped moisture in the part, out-gassing at temp, and fracturing the part. I have seen this on ceramic resonators in the past; don't know why this type of part seems prone to this
Electronics Forum | Sat Nov 17 18:29:02 EST 2007 | bbarton
Let's face it guys...in most cases (stress the MOST!) a typical FR4 board will do the job. Few layers, low copper, not too densly populated etc...no worries. Use a reflow profile which avoids the 245-250C range, use a shorter TAL, Viola you have a go
Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef
Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree
Electronics Forum | Tue Nov 20 17:07:20 EST 2007 | kennyrebbe
I am looking for a new semi automatic Stencil printer, and reflow oven that is capable of doing double sided boards with BGA�s. We currently own a Manncorp 4500R stencil printer https://www.manncorp.com/4x00_stencil_printers/index.php?view=overview&a
