Electronics Forum | Tue Jan 23 11:37:13 EST 2007 | electronhose
Here in the Great White North, the best way to check our CM's compliance with the ESD 20.20 is to take a couple months worth of data during heating season and graph it against the outside temp swings. You can easily see how the HVAC system keeps up,
Electronics Forum | Wed Jan 17 03:52:20 EST 2007 | Vladimir
Hi, I am process engineer of SMT production. We have some strange problemn with tantalum capacitors. 1 case: If tantalum capacitor placed near BGA and one of his legs is connected to one of the BGA balls, after reflow we can see short between two or
Electronics Forum | Wed Jan 17 17:17:21 EST 2007 | russ
i would say that you are there already. with 10,000 DPM0 you have a 1% fallout, you are at 99.9 basically. 1 out of a 1000 boards will fail? of course one thing we need to know is how many opportunitites do you count for a chip resistor for exam
Electronics Forum | Fri Mar 09 17:49:08 EST 2007 | Frank
Thanks, Michael, this proves my point. There are already shows everywhere, so if you don't want to fly to LA and get "shot at", by all means, go to your local show. If enough people stop going to APEX (SoCal) then the other shows will gladly take u
Electronics Forum | Wed Jan 24 10:08:36 EST 2007 | electronhose
Immersion Silver, ImAg, is becoming the finish of preference. This is due to it having similar process limits vs. SnPb HASL. There were some early concerns about shelf life, but new chemistries have extended finish shelf life to 12 months+. Many boar
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Thu Feb 01 07:06:46 EST 2007 | Sami
thanks to all . I am using GSM Genesis machines. I am also using using a single board without any offset. When I tried to test the first board for a new product, I can see the shiffting in the placement of some components. Yes I know that the default
Electronics Forum | Tue Jan 30 12:58:49 EST 2007 | barryg
We are seeing problems with platinum over silver plated part also. Our main problem is solder splatter under these devices, and voiding at the terminations on parts off the reels.I am curious if you have removed any of these parts and noticed any spl
Electronics Forum | Fri Feb 16 06:47:38 EST 2007 | CL
vshan, We were using pallets (delmat with cavities for the flex) We put stips of double sided Kapton tape in the critical areas. The tape held up to the heat and kept the circuit flat for the QFP's and BGA's. We based our assembly process for this c
Electronics Forum | Wed Feb 28 16:46:08 EST 2007 | jmelson
Philips is out of this business. They spun off the SMT business as Assembleon America. Their site is partially closed, and I don't know what hoops you have to jump through to become a member. The open part of their site gives no result when you se
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