Electronics Forum: after (Page 518 of 698)

Crazing or Delam - Thermal or Mechanical?

Electronics Forum | Fri Jun 19 07:28:56 EDT 2009 | mhunter

Thank you for your responses Davef and Boardhouse. The material used is Iteq Corporation IT-180. I performed more testing yesterday and found the following: I could insert Berg Pins into the assembly at various locations or a Pem. None of these

Stencil Fiducial Repair

Electronics Forum | Fri Jul 24 10:36:12 EDT 2009 | bschreiber

The issue is not with the stencil cleaner, it is with the construction of the fiducial. Ultrasonics is very effective in cleaning and penetrating into small microscopic cracks and crevices (this is one reason why ultrasonic stencil cleaners are so

AOI Sony vs Orbitech

Electronics Forum | Fri Aug 14 10:51:30 EDT 2009 | rway

If he is the same Martin Gershenson who works for Christopher, then I'de believe he's being sneaky. We demoed one of their units three years ago, along with Mirtech and YesTech. Of the three, they were the only ones who wouldn't let us experiment w

MPM UP2000 HiE Z problem

Electronics Forum | Fri Aug 07 09:53:12 EDT 2009 | kpm135

The Z-axis Drive card on our MPM UP2000 HiE fried. We replaced it with a new card, setting all the jumpers to match the old card. After that we had to recalibrate the Z-axis and the snugger height but the problem is that the camera is now too close t

Vapour phase soldering - problem

Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad

One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,

Low Silver Solder Problems

Electronics Forum | Sun Aug 23 07:03:09 EDT 2009 | ghepo

OK Eric, is difficult answer at distance without examine the PCB..., anyway in my opinion the problem is the PCB quality. There are two possibility : the crack is between solder and nickel or is between nickel and pad copper. In both situation the

Low Silver Solder Problems

Electronics Forum | Mon Aug 24 13:12:28 EDT 2009 | ghepo

OK Eric, maybe you're right. My suggestion is to proceed by exclusion. First perform the tape test. Is easy and without costs. You have used many similar PCB without problem, but from the same vendor ? Is my experience that in similar cases the qua

IPII PCB lifter timing out?

Electronics Forum | Tue Sep 01 12:47:37 EDT 2009 | rodrigo

Hi all, Our IPII just developed yet another issue. The PCB goes in the conveyor and when in the loader, the lifter goes up and after a few seconds I get a lifter cycle alarm error. I checked the in/out screen and when I make the lifter go up, the se

ENIG CONTAMINATION

Electronics Forum | Fri Oct 09 13:37:55 EDT 2009 | tstrat

We are seeing similar issues. We have a board that consistently has failures on a BGA part. After SEM/EDS it was shown that the fractures were occurring between the Ni-P and Ni-Sn intermetallic in the ENIG finish. The element map showed elevated conc

Mydata M12 issue

Electronics Forum | Mon Oct 05 08:19:13 EDT 2009 | rgduval

We've been having random transducer errors on our TP recently. After speaking with MyData tech support, we were told the answer could be: 1. the transducer(s), 2. something causing undue friction, 3. something undiagonsed yet. Their recomendation


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