Electronics Forum | Mon Jun 01 09:32:29 EDT 1998 | Dave F
| This message is to Cunli and his great staff who keep us flying straight and level while reminding us always to keep our nose down in the turns. (can't keep from doing some of that pilot "s__t" Mav. | I, I mean we, would like to post some tempters
Electronics Forum | Thu May 28 09:30:42 EDT 1998 | Chrys
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Wed May 27 16:02:32 EDT 1998 | Chrys
| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to
Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory
Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound
Electronics Forum | Thu May 21 22:19:11 EDT 1998 | Steve Gregory
I hear ya' Earl! I don't know why there seems to be such a push for us to eliminate lead...you're right, assemblers are pretty clean when it comes to lead....actually, the whole industry is, when compared to other industries and the amounts of lead t
Electronics Forum | Fri May 15 19:06:34 EDT 1998 | Steve Abrahamson
We are looking to bring in a HP 5DX System. This is the laminography equipment formerly known as Four Pi. I have our sales rep getting us a few references, but I wanted to get some opinions from the tech net. I am looking for input from someone wh
Electronics Forum | Wed May 06 09:16:51 EDT 1998 | justin medernach
| I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventua
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Wed Apr 22 22:24:15 EDT 1998 | Steve Gregory
| I need information about SMT machines, technology and mannufactures. If possible give me e-mail or web site's adresses Good Day Igor!! I could give you my opinions about different machines that I've worked with, but that would just be MY opini
