Electronics Forum | Thu Jan 04 21:27:39 EST 2001 | John L.
Thanks for the reply Stevo...! I am looking at doing just that. I would really like to ID this component and repair this Pico board though... After several searches, I can't find any (3) element resistor or capacitor networks to match it. I'm hop
Electronics Forum | Wed Dec 27 21:12:30 EST 2000 | Dave F
From a process perspective, I don�t know if you should be concerned ... You've told us nothing about your process. THE BOOK JEDEC MO-51 allows 6 thou warp in smaller [1mm pitch] BGA and 8 thou in larger [ 1.27mm and 1.5mm pitch] BGA. The increase
Electronics Forum | Fri Dec 22 12:17:02 EST 2000 | vickij
Hi! Has anyone out there ever tried to use a high-temp and a low-temp solder paste on a double-sided board without using an adhesive? (Populate the bottom side with the high temp paste, reflow, turn it over, then run the top side). I looked in the
Electronics Forum | Tue Dec 26 11:09:16 EST 2000 | acahill
High temp paste or not, I feel it's all up to the oven,and/or the stencil design. are there sufficient solder joints, before running the opposite side (are the apertures large enough to achieve a hardy fillet or to small, allowing enough paste to vis
Electronics Forum | Tue Dec 26 15:22:43 EST 2000 | Hussman
Vickij, Why not try using regular temp. paste for both sides? Unless you have some real heavy parts on both sides, you can run a double-sided reflow process with most boards. I myself like to place R's and C's first (or bottom side) and then do an
Electronics Forum | Thu Dec 21 14:29:08 EST 2000 | CEFD
There must be a good reason for somebody to say that; I just can't think of one. We have a CRT and there is an issue with flux affecting the performance of the machine, but it is not terribly bad. Run your reflow profile the way it is supposed to run
Electronics Forum | Thu Dec 21 08:16:48 EST 2000 | CAL
Keith - please call our help line a 610-362-1320. The information you request needs more clarification and can be better discussed via a telephone call. Sorry not to provide a definitive answer nor to provide a solution for others on SMTNET but your
Electronics Forum | Thu Dec 21 22:31:28 EST 2000 | Dave F
Sorry, but I'm a bit fuzzy on the goal here. Let me be basic. The basic reasons for reducing the life of products before they're shipped are: * Design qualification. This highly accelerated test beats the living stuff out of products to identify d
Electronics Forum | Wed Dec 20 17:33:00 EST 2000 | Travis Slaughter
I don�t have the answer for you but it would not be difficult to make a fixture to find out. Combine a counter, pneumatic cylinder, and a solenoid in such a way to do the job for you. Cylinder pushes the card into the connector, when contact is made
Electronics Forum | Tue Dec 19 20:01:41 EST 2000 | Lisa Murphy
Hi, I have recently been asked if I had any information on the voltage capacity of a solder ball. I asked around and did a web search but came up empty handed. Usually people are concerned with the current carrying capacity of bondwires, flip-chip
