Electronics Forum | Mon Oct 28 09:48:10 EST 2002 | gregp
If I understand correctly you want to pick BGAs from the ball side using some type of vacuum arrangement. You will find that the reliability of this is dependant on the size of the balls and the pitch. The larger the balls and tighter the pitch, th
Electronics Forum | Fri Nov 01 09:35:52 EST 2002 | James Bartlett
MINIMUM NDSU EMEG EQUIPMENT SPECIFICATIONS (11/1/02) To serve microsensor research and development via the Center for Nano-scale Science and Engineering (CNSE), the North Dakota State University (NDSU) Electronics Manufacturing Engineering Group (EM
Electronics Forum | Fri Nov 08 14:48:58 EST 2002 | davef
Yours is (12 thou x12 thou)/(2x(12 thou +12 thou)x5 thou) = 0.60 * Aspect=W/T for electroformed stencils SB GT 1.1 => Yours is 12 thou/5 thou = 2.40 So, we kind of think of what you�re trying do as maybe printing a 16 pitch QFP, which gives you simi
Electronics Forum | Thu Nov 14 00:06:23 EST 2002 | iman
note: retyped due to some earlier technical fault. does anyone know what environment factors(specifications?) and process control parameters(printer & reflow?) are optimal for running SMT using type 4 and type 5 solder paste respectively? Any pitfal
Electronics Forum | Fri Jan 03 12:12:22 EST 2003 | richard
Good day and thanks for your comments Mike, What did I understood from your notes� 1) ROSE test (�extracting solution�) is probably good enough (with good equipment) to penetrate the space under my micro BGA. 2) I should test 2 parallel batches of
Electronics Forum | Tue Feb 11 17:14:50 EST 2003 | Matherat
Traditional methods of hand assembly are as you described. For a company that is concentrating on the 1-5 or 5-50 quantities you've described, you need to look for ways to accomplish your task with speed, repeatablilty, quality and at a fair price. T
Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef
You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai
Electronics Forum | Tue Apr 01 11:50:08 EST 2003 | rdr
Dave, thanks for the info. This sounds like it would verify the presence of an open. We have verified that these balls are open and I am trying to figure out if we are fracturing or not wetting. causing these opens. I would use the die method on ne
Electronics Forum | Wed Apr 09 20:05:21 EDT 2003 | davef
Kevin: We know of no handy approach to developing recipes. * Certainly programs provided by profiler suppliers give you a good first pass, based on your oven and solder paste. * Second pass in developing your recipe comes through trail and error chan
Electronics Forum | Fri Sep 12 00:19:37 EDT 2003 | Dean
In my humble opinion: 1. Use of computers and software to support cad programming and industrial automation. 15 years ago I was making programs with a pair of calipers and a swing arm digitizer. Now in a few hours an entire line (2 P&P machines,
