Electronics Forum: differs (Page 522 of 579)

Re: Bottom side bridging

Electronics Forum | Wed Apr 15 15:04:18 EDT 1998 | D. Lange

| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble

Re: Bottom side bridging

Electronics Forum | Wed Apr 15 14:57:20 EDT 1998 | D. Lange

| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble

Re: Bottom side bridging

Electronics Forum | Wed Apr 15 14:53:06 EDT 1998 | D. Lange

| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble

Re: Bottom side bridging

Electronics Forum | Mon Apr 13 08:47:09 EDT 1998 | Bob Silveri

| | | | | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no

Wave Soldering Thick PCB's

Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW

Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se

AOI ( automated optical inspection) benchmark

Electronics Forum | Tue Feb 19 13:37:48 EST 2002 | PeteC

When evaluating AOI you must first define what type of inspections you want the system to perform, pre-solder or post-solder. What separates many mfgs. of these systems is how effective they are at finding post solder defects. This is where camera re

Process control, SMT inspection and rework

Electronics Forum | Tue Apr 09 21:40:26 EDT 2002 | ianchan

We are a local enterprise with limited resources, just like you described, so hope this experience sharing helps : we place a production Visual Mechanical Inspection (VMI) inspector at the end of each Reflow Oven area, complete with magnify scope 30

SMT COMPONENTS

Electronics Forum | Tue Jul 23 12:02:17 EDT 2002 | gdstanton

Ken, Excellent discussion!!! I've also seen this problem. Spent and am still spending significant time policing. I don't think it is just a buyer issue though. There are many dimensions to the problem. Suppliers, Engineering, Manufacturing, and

solder ball after reflow owen

Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks

Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a

Ap25 camera went all wiggly

Electronics Forum | Mon Sep 02 15:20:48 EDT 2013 | aemery

Interesting! not the usual error. In my experience when the vision cables get damaged it shows up and white noise flashes across the monitor. The connections are the easiest to check so here's your system layout with connection points. Starting at


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