Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Wed Jun 11 10:24:23 EDT 2003 | kris
Hi, The percentage of lead (0.1% or otherwise) is still being debated in the EU where the legislation is in place. The industry is pushing for a 0.2% limit,(if lead-free has to be) as it is considered a limit where solder can be recycled economical
Electronics Forum | Wed Jun 11 15:57:39 EDT 2003 | pjc
Frank, ECD (WaveRIDER) and Datapaq (Optimiser) have wave solder machine process control devices. They will check the following: 1. Conveyor speed 2. Preheat Temps 3. Solder Temps 4. Wave Dwell/Contact Times 5. Wave Heights 6. Waves Parallelism Go
Electronics Forum | Tue Jun 24 08:12:34 EDT 2003 | Robert MICHEL
We just bought in the US a second hand screenprinter DE HAART DL20 . we understood this company is out of business. Is there anybody who can give us information regarding the functioning of this printer or give us references of a company who follows
Electronics Forum | Wed Jul 02 06:34:32 EDT 2003 | mkehoe
???? What? I think I follow your logic. Bottom line is, using the same name, p.1 (that's p (dot) 1) over and over for every stencil you produce can lead to confusion both in our CAM dept as well as our vendors. Like calling every board you produce PN
Electronics Forum | Wed Jul 02 17:46:23 EDT 2003 | csimfgeng
WOW! Just when you thought you had seen it all! I follow your logic perfectly and concur. I bet the first time your customer loses a valuable customer because of a file mix-up, they may change their tune. "Doing things the way they have always
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
Electronics Forum | Mon Sep 22 08:57:54 EDT 2003 | sungels
Hi, I am looking to purchase the following parts 1. B39431-R2632-B110 2. B39431-R2630-B110. The above part was manufacturered ny EPCOS, package T039. Please advise if someone have these in stock for sales or know someone with whom i can order the
Electronics Forum | Mon Sep 22 09:00:58 EDT 2003 | sungels
Hi, I am looking to purchase the following parts 1. B39431-R2632-B110 2. B39431-R2630-B110. The above part was manufacturered ny EPCOS, package T039. Please advise if someone have these in stock for sales or know someone with whom i can order thes
Electronics Forum | Mon Sep 22 09:02:18 EDT 2003 | sungels
Hi, I am looking to purchase the following parts 1. B39431-R2632-B110 2. B39431-R2630-B110. The above part was manufacturered by EPCOS, package T039. Please advise if someone have these in stock for sales or know someone with whom i can order thes
