Electronics Forum | Fri Sep 24 10:57:18 EDT 1999 | Earl Moon
| Hi Folks: | | We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. | | The bridging is happening after coming out of reflow...one la
Electronics Forum | Fri Jul 27 12:34:47 EDT 2001 | loriannplummer
My engineering couterpart has the task to evaluate AOI and we will be receiving one next month. In most of the articles I've read, AOI is deemed effective post paste and post pick-and-place (pre-reflow), but there are rarely discussions about post re
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Thu Oct 08 12:11:34 EDT 1998 | Rick Wyman
| Does anyone know of an AOI system that can look at the solder joints of SMT chip devices (1206,0805 & 0603) and make a reliable presence/abscence call of the joint on a HASL PCB. A low false call rate (much less than 1%)is required. Any info. fro
Electronics Forum | Fri Jun 01 22:49:50 EDT 2007 | mika
These ones from ALTERA the QFFP-304 0.5mm weight: 32gr. used to give us a really headache in the past. Not only soldering issue:s but also the placement in x-y-theta! The stencil thickness of ours is 0.13mm and because of ohter compomponent packages,
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Sun Oct 07 07:34:25 EDT 2001 | davef
No one wants to be limited to one alternative in evaluating such equipment. Who would you suggest as viable alternatives to: * Cyber Optics in evaluating alternate suppliers for inspection equipment? * Royce Instruments in evaluating alternate sup
Electronics Forum | Thu Dec 25 02:44:53 EST 2003 | Grant Petty
Hi, Thanks for the advice, and what models are you running. They have a few different models Horizon, etc, and I am trying to work out what would be best for us. I need accuracy, and reasonable speed, but also want to get the inspection options, as
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Wed Mar 16 09:06:07 EST 2005 | russ
This is what I might do, I would purchase either a solder volume (preferred) or at the least a paste height measurement piece of equipmment, The most important parameters with pronting are volume and registration. You need one of these inspection
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