Electronics Forum | Fri Feb 22 00:46:18 EST 2002 | djarvis
How about that. Gets through to the second round of the 1500m on his arse going BACKWARDS. Then falls on the last turn of the second heat! He said "I thought I might be a bit tired as I hadn't slept for 34 hours two days before, after the "Medal". M
Electronics Forum | Wed Mar 27 21:20:30 EST 2002 | davef
There is two major BGA coating camps. * Camp #1: "We require the coating to be under low stand-off devices but with no filleting. So we apply a thinned dip coat first, and then top-off with a proper spray coat" * Camp #2: "We want no coating under th
Electronics Forum | Fri May 03 06:03:26 EDT 2002 | geoff_goring
Dave Many thanks for your very informative piece on SMT.com As we stand we have not yet 'seen' any problem. My issue is that we have ordered (LTB) a very large quantity of ASICS and our usage has taken a down-turn. We therefore need to keep the one
Electronics Forum | Wed May 22 21:01:49 EDT 2002 | davef
Ah, the customer is always correct, again. And you are officially �painted into a corner�. Actually, your customer is not correct. Thinking that money is going to be saved by specifying copper component terminations [or whatever in the world they
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Tue Jun 11 14:45:59 EDT 2002 | stefwitt
I can not find a F4G in Fuji�s equipment list. Siemens has a F4 ( flexible fine pitch machine ) and also a GII ( glue dispensing machine ), which both would make sense to add to your equipment list. Machines are �connected� together with their conve
Electronics Forum | Tue Jun 18 21:17:00 EDT 2002 | Todd
Gee Ken, the old cart business must really be slow, I see you commenting on any old item in the forum in an attempt to hawk your carts and how they improve efficient factory operation. I have read your white paper and found it very entertaining to se
Electronics Forum | Mon Jun 17 21:33:20 EDT 2002 | davef
Ken, Yes, when quality is good, increasing throughput of a bottlenecked resource [lowering costs] is a fine goal. [Wouldn't E Goldratt smile?] In MY real world, quality is not as good as it should be. We have: * Suppliers that do not do as asked.
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Tue Jul 02 15:50:28 EDT 2002 | blnorman
FIrst, be a doubting Thomas and never trust supplier propaganda sheets, do your own testing. How often do you knead the paste? We have a standing requirement that if the paste printer is idle for 30 minutes, we have a minimum of 4 kneads before pri
