Electronics Forum | Tue Sep 14 10:10:39 EDT 2010 | teamcanada
We are having an issue with a PCB supplier. Their Tin HASL layer seems to be the problem. We have triedworking with them to correct their process. What seems to have helped is lowering their temperature of the Tin dip from 540 F to 510 F.We still ha
Electronics Forum | Fri Sep 24 16:01:07 EDT 2010 | dougt
I remember this problem but can't remember exactly what the reason was. It might have been the wrong pullup resistor on the MEI interface board used for the home photo on the y axis. You are right, after a couple hours the machine would work fine.
Electronics Forum | Wed Sep 29 14:19:48 EDT 2010 | davef
In trying to understand your situation better, you say, "The problem is in production. It is difficult to solder SMT package. I was thinking of 1206 package." Please clarify: * What is difficult about hand soldering your SMT part? What is the part
Electronics Forum | Fri Oct 15 11:32:04 EDT 2010 | patrickbruneel
Inspecting for plating problems shouldn’t be part of incoming inspection. Your board manufacturer should have the appropriate process control. I shouldn’t have said barrel cracks but plating skips. Plating skips are caused by dull drills or a too hi
Electronics Forum | Mon Oct 25 05:52:34 EDT 2010 | sachu_70
In csae you use 2 fiducial recognition, ensure that board fiducials are oriented across a diagonal and spaced far apart. Also, maintain a prefered dia between 1-2 mm for the fiducial on board to have have a better correction factor recorded during fi
Electronics Forum | Fri Nov 05 12:25:42 EDT 2010 | deanm
I think you are right. According to IPC-7526 section 6.2 says that using compressed air to blow out paste will damage the stencil, especially between fine pitch apertures. It can also broadcast solder paste onto other surfaces or personnel. I recomm
Electronics Forum | Wed Nov 24 17:09:41 EST 2010 | bandjwet
We are working on placing an RF shield. Sometimes we have been dispensing paste (if the board is already populated), othertimes we have been printing the paste pattern (unpopulated board). Now we have a case where the customer is insisting on a pre
Electronics Forum | Tue Dec 07 04:23:27 EST 2010 | Jacki
Dear All I hope I can get some advice of PCB experts in here.My problem is - after wave, our big board, 640x420x1.7mm, had a warpage when the board was cooled down after wave. PCB was flat while being warm.I had tried with many type of pallet and mad
Electronics Forum | Sun Dec 19 23:22:11 EST 2010 | Jacki
Hi Rem Woo, ur board is such long one,7'. Our PCB is only 2' long but 3.5kg weight b4 solder. We use wave machine to solder it and PCB was sit on the pallet. all PCB side lengths are pressed by clamps. PCB was flat just after wave, however there was
Electronics Forum | Mon Dec 20 04:41:38 EST 2010 | accuspares
Hi, The input indicators can be located by selecting the 'Input' page located in the 'Diagnostics' drop down menu. Just select the Align tab at the top of the page and you'll be able to see when the nearly home and home sensors change state. The pr
