Electronics Forum | Mon Jun 19 22:19:40 EDT 2006 | Nathan
Dear All, We plan to setup an assembly line for our small volume production of PCBs (about couple hundred PCBs per week). The board has about 150 components (less than 30 types) and a few BGA and IC (majority is SMT, only few THT connectors). We hav
Electronics Forum | Fri Jul 07 03:27:31 EDT 2006 | dougs
Hi folks, thanks for all the tips. We have run our first batch of these flexi boards now. I had the PCB suppliers make me some 1.6mm FR4 carriers to lay the boards on to carry them through the process. (1 flat & 1 with cutouts for the second side)
Electronics Forum | Wed Feb 21 06:11:41 EST 2007 | CL
Good Morning, We have 5 Mydata MY machines in separate lines. We are placing 0201's, uBGA's, CSP's, etc.... I cant say that we have never had accuracy problems but whatever caused the problems was identified and they are fairly accurate as far as I'
Electronics Forum | Thu Sep 14 13:13:29 EDT 2006 | Kevin W. Parker
I am a tool and process engineer responsible for the cleaning system at Siemens VDO in Huntsville, AL. I have been over this area for more than 8 years. We use EMC Cyberclean 3000RF spray in air cleaners with Zestron SC202 chemistry. At this facil
Electronics Forum | Sun Nov 19 16:37:06 EST 2006 | finepitch
Hi RJK, 2.5 years ago, I pointed out the exact same thing you did now. (please see the below link) http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=7076&#Message28261 I am a competing brand's rep for 3 years, but p
Electronics Forum | Wed Sep 13 10:31:14 EDT 2006 | CL
Hello Brad, We are running the Slim Kic 2000. We have found the predictions to be fairly accurate as long as the suggested change is within 20 degrees of the original recipie. As a test I ran a board with the wrong profile. The predictions got me wi
Electronics Forum | Tue Nov 14 21:27:26 EST 2006 | davef
"Hidden pillow" seems to be a a variant of "pillow effect" or "head in pillow". Pillow effect is an open, with non-wetting between the lead and the solder on the pad. Here the lead sags into the solder without any bonding or wetting. Poor wetting c
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514
as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
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