Electronics Forum | Thu Sep 02 14:26:22 EDT 2004 | frankracine
Thanks Russ, very interesting. Are you working with a printer, PNP, reflow and wave? Did you change apertures in your stencils with lead free ? Concerning reflow, do you have a 5 zones, 7 zones ... ? Are you using the same alloys for solder paste
Electronics Forum | Tue Aug 31 11:57:03 EDT 2004 | Kris
Hi Any body have any issues soldering tin lead solder paste with lead free terminations ? Components are leaded devices and chip components have read the theoritical discussions on the forum, need to know if any body has seen any real issues tod
Electronics Forum | Thu Sep 02 22:39:58 EDT 2004 | davef
Comments are: * Few of us use IR reflow. It has been replaced by convection or a combination of convection and IR. * Follow the recommendations of you paste supplier in determining the initial thermal recipe for your oven. * Look here to learn more
Electronics Forum | Thu Sep 30 09:49:54 EDT 2004 | davef
Armin Habba could be considering a situation where: after they convert to no-lead they receive components with lead-bearing solderability protection from their component supplier. This could happen when: * Supplier has not converted to no-lead. * O
Electronics Forum | Fri Oct 01 16:12:00 EDT 2004 | palmerg
As long as they're good. Have you guys had any free "help" from so called engineers that turned into a costly waste of time (both in resources and line down). I have heard some real horror stories from former co-workers. I haven't heard this about th
Electronics Forum | Fri Nov 19 16:38:15 EST 2004 | grayman
Hi, We only use alcohol for cleaning stencil but it gives us best result even with no clean solder paste. We are using Branson.Furthermore, we have fine pitch components.Try cleaning the tank maybe there are solder accomolation in the tank or try in
Electronics Forum | Mon Dec 06 12:27:01 EST 2004 | Scott B
We are currently reviewing a design which has a leadless chip scale package with a solder thermal pad on the underside. The application notes for the device specify use of a no-clean solder paste as the gap under the device will prevent cleaning. Is
Electronics Forum | Sun Feb 06 12:03:32 EST 2005 | dhanashekar
can some one give me some suggestion to solve the problem. we are using cooksun/alphametal rma9086 paste for our screenprinting. after the reflow we see lot of solder ball on the board. we have maintained the exact profile given by the manufacurer. w
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN
Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like
