Electronics Forum | Wed Jul 04 14:22:51 EDT 2001 | davef
I just rooted through an analysis that we did five or six years ago [so current it aint] and finally found the goods. We talked to Vitronic, Heller, Electrovert, IR, and Conceptronic. Only Electrovert had a 2.75" throat [rail to top of board cleara
Electronics Forum | Thu Jul 05 06:36:14 EDT 2001 | nifhail
Thanx Dave, I agree with you on the planning part...yapp!! the same guy who've thrown an old datecode components to me..now they did it again on the PCB. Well Dave, could you explain a little bit more about the "hi-test flux" that you mentioned ab
Electronics Forum | Thu Jul 05 06:38:35 EDT 2001 | Danial
Thanx Dave, I agree with you on the planning part...yapp!! the same guy who've thrown an old datecode components to me..now they did it again on the PCB. Well Dave, could you explain a little bit more about the "hi-test flux" that you mentioned ab
Electronics Forum | Thu Jul 05 11:14:04 EDT 2001 | caldon
We can offer two ways. We have a process control tool for OSP boards to validate the finish......but the dates yer talking may be best to take Daves F suggestion. NOW as far as the HASL finish goes...We may have your answer. We can Chemically revers
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Thu Jul 12 20:50:37 EDT 2001 | davef
One possible reason no one brought-up "too much paste" is that suggestion has been proffered so many times that it�s in the archives like the layers of sediment making-up Kataden. Another thing [we can argue about this], using home plate apertures w
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef
Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon
