Electronics Forum | Fri Mar 19 12:09:17 EST 2004 | Primus
I'm just getting more involved with SMT, as I've been a through-hole operator for years. But I don't understand how one could reflow SMT components AFTER the through-hole insertion and solder wave are finished. How does one print paste over a board w
Electronics Forum | Mon Aug 07 04:05:43 EDT 2023 | suradi
May I share regarding this issue. Initially, please define the root cause clearly, is it from materials or process. Refer to the picture, if the short location is not randomly meaning there is the process issue. It could be stencil design or paste pr
Electronics Forum | Wed Mar 16 09:06:07 EST 2005 | russ
This is what I might do, I would purchase either a solder volume (preferred) or at the least a paste height measurement piece of equipmment, The most important parameters with pronting are volume and registration. You need one of these inspection
Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Thu Oct 04 00:00:58 EDT 2018 | gaintstar
Flason SMT Reflow Ovens: http://www.flason-smt.com/product/China-Reflow-oven.html http://www.flason-smt.com/product/China-Samsung-EXCEN-PRO-High-Speed-SMT-Modular-Chip-Mounter-agent.html http://www.flason-smt.com/product/China-Samsung-SM321-High-Spe
Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef
Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen
Electronics Forum | Fri Aug 04 04:26:31 EDT 2000 | Charles stringer
I am experiencing a problem when soldering down a TO263 package. The device has a large solderable tab (approx 8mm square)on the back and 5 leads. Sometimes the leads are not soldered to the board properly. I am using a metal mask with 9 "windows" of
Electronics Forum | Thu Feb 10 16:00:31 EST 2000 | Travis Slaughter
I have had cases when it was necessary to run epoxy and paste at the same time. The only good reason I know of to even think about messing with going to this trouble is if the surface tension of the solder melting pulls the part out of alignment. T
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Wed Dec 04 10:59:04 EST 2019 | dwl
The solder looks a little grainy for Sn/Pb solder but that might just be the picture quality. There appears to be plenty of solder on the pads, so I'd rule out anything to do with the stencil. One possibility that springs to mind; how long is your
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