Electronics Forum: electronics (Page 5282 of 7892)

Selective pallet thickness

Electronics Forum | Mon Apr 23 14:59:56 EDT 2001 | relensky

I have been using pallet from Integrated Ideas and Technologies (www.integratedideas.com). They offer a "laminated" pallet that can have the various layers cut in several thicknesses. They are very helpful and willing to solve problems. The best p

capacitor shelf life

Electronics Forum | Fri Apr 13 05:07:57 EDT 2001 | zam_bri

Hi Dave, Thanx for your reply. What is it in the process of manufacturing the capacitor that can go wrong until it can caused the chips to be chipped-off or cracks. I've encountered alot of this problem lately. First I thought it was our process t

capacitor shelf life

Electronics Forum | Fri Apr 13 10:47:28 EDT 2001 | davef

I'll respond directly to your question about capacitor fabrication in a later posting, but more importantly and possibly more directly in response to the situation many hands touch your capacitors before you do. Each of these stockroom personnel, UP

Thermocouple attachment on fine pitch component.

Electronics Forum | Wed Apr 11 17:03:28 EDT 2001 | mparker

I've used Super Glue, with Kapton tape. The glue leaves a small residue and the tape acts as a strain relief. If you can sacrifice the board, drill a small hole through the board, push the exposed ends of the thermocouple up from the back side, lay

THERMAL PROFILING

Electronics Forum | Thu Apr 12 03:55:06 EDT 2001 | surachai

Dear anyone ; Every time that we run profile now ,we will create profile from recommendation of vendor flux and the some critical parameters such as thermal shock or others ... but I don't know that Do you ever create standard profile to be procedure

Stencil Cleaning

Electronics Forum | Fri Apr 13 05:59:58 EDT 2001 | zam_bri

I�ve just had an argument with my Boss on the frequency of Stencil cleaning. He told me to remove the procedures that asking the operator to send the Stencil for cleaning ( using Automatic machine ) after every 8 hours. I said big NO!! NO!!. He said

solder on gold finger

Electronics Forum | Fri Apr 13 12:37:35 EDT 2001 | edylc

>>> gold finger was covered by a Kapton tape and it was done offline away from the Screen printer or rather from the SMT lines itself, we are using an ENIG Pcb's , the process doesnt need a wave soldering ....however at the final end of the line ,

solder on gold finger

Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc

Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of

Pad Design

Electronics Forum | Mon Apr 16 10:01:43 EDT 2001 | onset

Please help, Engineering has come to me with a crazy idea of putting vias straight through 0805 pads due to limited board space. I was wondering if this has ever been attempted by anyone and if it works. I'm assuming it will have negative affe

advice

Electronics Forum | Tue Apr 17 08:54:09 EDT 2001 | davef

Process capability indices are pretty well documented. Consider: 1 A good general SPC book like: Statistical Quality Control; EL Grant & RS Leavenworth; Mcgraw-Hill; ISBN 0078443547 2 Other good books are: Statistical Process Control For SMT; WS


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