Electronics Forum: 0.8 (Page 6 of 14)

Intercompatibility between different manufacturer machines

Electronics Forum | Wed Aug 26 09:02:35 EDT 2020 | sarason

This program will read a large number of modern machine formats and export to the same set of formats, as well as feeder movement, machine optimisation and up to 6 different manufacturers machines in the one line. And it only caosts $1000US. https:/

changing from no-clean to clean

Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef

Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.

Fuji CP6 and IP3 specifications request

Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler

The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs

IPC Spec for PTH Hole Size Tolerance

Electronics Forum | Wed Apr 10 11:46:28 EDT 2002 | mlovett

I would like to know the Stated Specification for PTH size tolerances. Or is there a generalised acceptable limit?. We have some PCB's with hole sizes that I consider to be way off what I would deem acceptable, ie Finished hole size should be 0.89mm

Repairing balls on BGA's

Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc

Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with

Solder Spheres, JEDEC Package Tolerances

Electronics Forum | Mon May 29 07:46:30 EDT 2006 | bwet

In reviewing the JEDEC 95 guidelines (2002) there is not a mention of tolerances that have been agreed upon for today's finer pitch devices. There was no mention of the solder diameter tolerances (low melt temp) allowed for 0.8mm, 0.6mm and 0.5mm pit

RJ45 Connector short issue after wave

Electronics Forum | Sat Jun 07 04:01:56 EDT 2008 | carmanah

Hi all, Need advice how to fix RJ45 short issue after wave solder m/c .Few actions taken to resolve this issue but the outcome was inclusive which was 1. Modify wave pallet 2. Change conveyor setting from 0.8meter/minute to 0.7 meter/minute 3. Clear

PCB land pattern for RC0402 and CC0402

Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang

we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,

lead-free wave

Electronics Forum | Tue Jul 24 03:26:45 EDT 2001 | winnifred

Dr. Lee, For lead-free wave soldering, we are recommended to use SnCu0.7, why not 0.8 or more ?? Since SnCu0.7 has eutectic melting point at 227 deg C, does it mean with more Cu or less Cu, the melting point will be higher ?? Also, in lead solderin

Through Hole Machines

Electronics Forum | Mon Jan 31 05:25:54 EST 2005 | gaurav

Morning All, > > I have to choice between two > axial through hole machines: Panasert AVK 3 and > Universal VCD Sequencer 8. I will insert axial > components with 0,45 mm to 0,8 mm component lead > diameter and perform jumper wire insertion in t


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