Full Site - : 01005 pad (Page 6 of 17)

Viscom’s S3088 SPI Will Be Part of the NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Industry News | 2015-09-23 16:47:32.0

Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.

Viscom AG

Visit Booth #1527 at the IPC APEX EXPO ― PARMI to Showcase HS-70 Solder Paste Inspection System

Industry News | 2013-01-17 16:15:15.0

PARMI will exhibit in booth #1527 at the IPC APEX EXPO.

PARMI

PARMI’s HS-70 Solder Paste Inspection System Receives Circuits Assembly’s Prestigious NPI Award

Industry News | 2013-02-25 16:05:16.0

PARMI announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – SPI for its SPI HS70 Series.

PARMI

Deltec Selects 3-D SPI System from Viscom

Industry News | 2011-10-07 22:49:53.0

Deltec Automotive GmbH & Co. KG, based in Furth im Wald, has selected Viscom’s 3-D solder paste inspection system.

Viscom AG

Visit Booth #1249 at APEX – PARMI to Showcase SIGMA X SPI System

Industry News | 2014-03-02 18:55:28.0

PARMIannounces that it will exhibit in booth #1249 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

PARMI

PARMI Accepts an NPI Award at APEX for its New SIGMA X SPI System

Industry News | 2014-03-26 12:46:54.0

PARMI announces that it has been awarded a 2014 NPI Award in the category of Test & Inspection – SPI for its SIGMA X series solder paste inspection system.

PARMI

Shenzhen Huancheng Automation Equipment Co., Ltd

Industry Directory | Manufacturer

Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.

CyberOptics to Expand Product Portfolio with New SPI and AOI System at APEX 2010

Industry News | 2010-03-27 13:42:03.0

MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce its newest SPI and AOI systems in booth 2271 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

CyberOptics Corporation

CyberOptics to Showcase World’s Fastest AOI System and Award winning SPI System at G2010

Industry News | 2010-08-23 14:30:41.0

CyberOptics Corporation (NASDAQ: CYBE) will feature its award winning AOI and SPI In-Line inspection Systems at GlobalTRONICS 2010 scheduled to take place from September 13 - 15, 2010 at Sands Expo and Convention Centre, Hall A in Singapore.

CyberOptics Corporation

Hyundai Mobis Invests in CyberOptics’ SE500™ SPI System

Industry News | 2010-11-15 22:18:42.0

CyberOptics announces that Hyundai Mobis has invested in the SE500™ 100 percent 3-D solder paste inspection system for its Tianjin plant. Hyundai Mobis' investment totals approximately US$500K.

CyberOptics Corporation


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